Comprehensive DFI’s Embedded Solutions
with 6th Gen Intel® Core™ Processors

【Taipei, Taiwan – September 2, 2015】- DFI, a leading provider offering a wide range of embedded  products for industrial applications, its new products based on 6th Gen Intel® Core™ processor family (codename Skylake), and it includes the following: 12 industrial motherboards, 2 single board computers (SBC), 4 COM Express modules and 1 compact ULT-based embedded system. These latest Intel® Core™ processors are built on Intel’s new 14nm technology using 2nd generation 3-D tri-gate transistors and deliver blazing fast computing and graphics performance. These new 19 products come with LGA/BGA-package processors designed with the Intel® C236/100 Series chipsets to target the IoT (Internet of Things) smart computing solutions that require scalable processing power, enhanced display capabilities, and product stability.

High-Performance Solutions on the Latest Platform
DFI, as an associate member of the Intel® Internet of Things Solutions Alliance, works closely with Intel on development of next-generation standards-based building blocks, platforms and solutions for the embedded market segments. To ensure our customers stay ahead of the competition, DFI has deployed a complete product line applying the 6th Gen Intel® Core™ processor. It covers from small form factor SBCs, industrial-grade motherboards to embedded systems such as the wide voltage and thin Mini-ITX motherboard – SU171/SU173; high computing workstation ATX board – SD631-C236; 4” fanless compact SBC – SU251/SU253; and COM Express Compact 15W ULT module – SU968.
  Mini-ITX microATX ATX SBC COM Express System
Workstation    SD331  SD631    SH960  
Desktop  SD101/103
Mobile          SH960  
ULT  SU171/173      SU551
 SU968  ULT System
DFI 6th Gen Intel® Core™ Processor-based Product Matrix
Excellent Graphic Performance
DFI’s 6th Gen Intel® Core™ processor-based boards support up to 3 independent video streams and increased display resolutions to provide a stunning Ultra HD 4K media experience. This new generation platform allows the embedded boards to drive breathtaking 3D video content and multiple displays simultaneously for a variety of graphics and compute-intensive solutions including medical imaging, gaming, digital signage, etc.
Memory Support Enhancement
The new embedded solutions are also able to support DDR4 memory with optional ECC capability which offers customers optimizing speed and power efficiency to process data faster and draw on the improved responsiveness. Taking the advantages of DDR4 memory, the motherboards can satisfy the ever-increasing workload demands of data centers and enterprise servers nowadays.

Advanced Manageability and Security
A new version of Intel® vPro™ Technology features, such as Inte Active Management Technology 11.0, enable enterprises to remotely manage and repair their workstations or servers in real time, thereby increasing efficiency. Furthermore, Intel® VT and Intel® TXT improve security and reliability by allowing critical applications like bank transaction to run safely in isolation and preventing unauthorized software from starting up.
With this new platform, the DFI’s industrial motherboards are expected to satisfy an array of embedded vertical markets and smart solutions in IoT networks with high speed I/O, cost-efficient, excellent security and manageability features.

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About DFI
Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 34 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. DFI Inc. is an associate member of the Intel® Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions. For more information, please visit us at:

*Intel and Intel Core are registered trademarks of Intel Corporation in the U.S. and other countries.

Contact Us
DFI Inc.
10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
 +886 (2) 2697 2986

15 Corporate Place South Suite 201, Piscataway, NJ 08854, USA
 +1 (732) 390 2815

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 +31 (10) 296 1840

DFI Co., Ltds
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
 +81 (3) 5209 1081

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building,
Bao'an Road, Bao'an 42th District, ShenZhen, China
 +86 (0755) 2372 9390