This product has the following features: COM Express Basic R1.0, Type 2, Intel QM67, 3rd/2nd Generation Intel Core processors, Embedded Computing, Industrial Control Automation, Digital Signage, Kiosk, Medical Equipment, Gaming Embedded Application. We sincerely wish it can meet your needs.

 
 
 
  Products    
 
HR900-B  
COM Express Basic R1.0, Type 2, Intel QM67, 3rd/2nd Generation Intel Core processors, Embedded Computing, Industrial Control Automation, Digital Signage, Kiosk, Medical Equipment, Gaming Embedded Application
Status:  Released
7 Years CPU Life Cycle Support
 
Features
處理器
3rd Gen Intel® Core™
2nd Gen Intel® Core™
晶片組
Intel® QM67
記憶體
2 DDR3 SODIMM up to 16GB
擴充
1 PCIe x16
5 PCIe x1
4 PCI
1 LPC
1 SMBus
8 USB 2.0
8-bit DIO
1 LAN
顯示
1 VGA
1 LVDS
2 DDI (HDMI/DP/SDVO)
存儲
2 SATA 3.0
2 SATA 2.0
1 IDE
Compliance
COM Express Basic R1.0, Type 2
尺寸
95mm x 125mm
Certification CE FCC RoHS MB-UL
 
 
 
  Comparison Datasheet Manual Quick Reference Inquire  
 
Specifications Packing List/Order Information Downloads
 
處理器
  • Socket G2 988B for:
    - 3rd Generation Intel® Core™ processors
      (22nm process technology)
      : Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
      : Intel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
      : Intel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
    - 2nd Generation Intel® Core™ processors
      (32nm process;technology)
      : Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
      : Intel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
      : Intel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
      : Intel® Celeron® B810 (2M Cache, 1.6 GHz); 35W
  • Intel® Advanced Vector Extensions (Intel® AVX) Instructions
  • Intel® Turbo Boost Technology
 
 
晶片組
  • Intel® QM67 Express Chipset
 
 
記憶體
  • Two 204-pin DDR3 SODIMM sockets
  • Supports DDR3 1066/1333MHz
  • Supports dual channel memory interface
  • Supports up to 16GB system memory
  • DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are supported for x8 and x16
    devices, unbuffered, non-ECC
 
 
板載圖形顯示
  • Intel® HD Graphics 4000 (3rd generation processors)
  • Intel® HD Graphics 3000 (2nd generation processors)
  • Intel® HD Graphics (Intel® Celeron® processors)
  • Supports VGA, LVDS and DDI interfaces
  • VGA: resolution up to 2048x1536 @ 75Hz
  • LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to 1920x1200 @ 60Hz
  • Digital Display Interfaces: HDMI, DP and SDVO (for Port B)
  • HDMI, DP: resolution up to 1920x1200 @ 60Hz
  • Supports 6 or 16 Graphics Execution Units (EUs)
    (3rd generation processors)
  • Supports 6 or 12 Graphics Execution Units (EUs)
    (2nd generation processors)
  • Intel® Clear Video Technology
  • DirectX Video Acceleration (DXVA) support for accelerating video processing
  • Supports DirectX 11/10.1/10/9 and OpenGL 3.0
    (3rd generation processors)
  • Supports DirectX 10.1/10/9 and OpenGL 3.0
    (2nd generation processors)
 
 
板載音效
  • Supports High Definition Audio interface
 
 
板載網路
  • Intel® 82579LM Gigabit Ethernet PHY
  • Integrated 10/100/1000 transceiver
  • Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
 
 
SATA 介面
  • Supports 4 Serial ATA interfaces
  • 2 SATA 2.0 with data transfer rate up to 3Gb/s
  • 2 SATA 3.0 with data transfer rate up to 6Gb/s
  • Integrated Advanced Host Controller Interface (AHCI) controller
 
 
IDE 介面
  • Supports up to two IDE devices
  • DMA mode: Ultra ATA up to 100MB/s
  • PIO mode: up to 16MB/s
 
 
智慧型零損耗監控
  • Monitors CPU temperature and overheat alarm
  • Monitors CPU fan speed and failure alarm
  • Monitors Vcore/VGFX/1.5V voltages and failure alarm
  • Watchdog timer function
 
 
擴充介面
  • Supports 8 USB ports (USB 1.1/2.0 host controllers)
  • Supports 4 PCI slots (PCI 2.3 interface)
  • Supports PCIe x16/SDVO/HDMI/Display Port switchable interface
    - Uses QM67's DDI (Digital Display Interface) Port B for SDVO/HDMI
       and DDI Port C for Display Port/HDMI
    - VBIOS default setting at Port C only; VBIOS settings modified
       upon request
  • Supports 1 PCIe x16 interface
    - Supports Gen 3.0 (3rd generation processors)
    - Supports Gen 2.0 (2nd generation processors)
  • Supports 5 PCIe x1 interfaces
  • Supports LPC interface
  • Supports SMBus interface
  • Supports IDE interface
  • Supports 8-bit Digital I/O
 
 
BIOS
  • 64Mbit UEFI SPI BIOS
 
 
功率消耗
  • 54.70 W with i7-2710QE at 2.10GHz and 2x 4GB DDR3 SODIMM
 
 
支援的作業系統
  • Windows XP Professional x86 & SP3 (32-bit)
  • Windows XP Professional x64 & SP2 (64-bit)
  • Windows 7 Ultimate x86 & SP1 (32-bit)
  • Windows 7 Ultimate x64 & SP1 (64-bit)
  • Windows 8 Enterprise x86 (32-bit)
  • Windows 8 Enterprise x64 (64-bit)
 
 
溫度
  • 0oC to 60oC
 
 
濕度
  • 10% to 90%
 
 
電源
  • Input: 12V, 5VSB (optional), VCC_RTC
 
 
PCB
  • Dimensions
     - COM Express® Basic
     - 95mm (3.74") x 125mm (4.9")
  • Compliance
     - PICMG COM Express® R1.0, Type 2
 
 
安規認證
  • CE
  • FCC Class B
  • UL
  • RoHS
 
 
PACKING LIST
  • 1 HR900-B board
  • 1 QR (Quick Reference)
  • 1 Drivers/utilities disk
 
 
Optional Items
  • COM630-B carrier board kit
  • Heat spreader: TBD
  • Heat sink with fan: A71-111009-001G
  • Heat spreader with heat sink and fan: TBD
 
*Optional and is not supported in standard model. Please contact your sales representative for more information.
DFI reserves the right to change the specifications at any time prior to the product's release. Please contact your sales representative for the exact revision offered in your area.