DFI® today launches the industrial grade EC300 series system, the latest addition to DFI's embedded system family. Its passive cooling and anti-shock drive bay mounting is designed for factory floor environments. The unique modular-concept construction supports 12 system configurations using three riser cards and three I/O module options in a cable-free assembly. Virtually unlimited systems configurations are possible using low-cost OEM I/O modules designed to meet custom OEM specification requirements.
The industrial embedded system boasts exceptional speed and high performance with the 3rd generation Intel® Core™ processors. In addition, the system takes full advantage of the Intel® QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance.
The integrated Intel® HD Graphics 4000/2500 engine delivers up to 50% 3D graphics performance improvement. Systems can be configured with up to 16GB DDR3 1333MHz memory, 2 USB 3.0 ports to process more data load, 6 USB 2.0 ports, 10 RS232/422/485 serial ports, 16 GPIO for device controls, and 2 PCIe/PCI expansion slots. A separate Mini PCIe slot supports wire-less connectivity using an optional Wi-Fi card and two front mounted antennas.
EC300 is capable of withstanding harsh environments to maintain system reliability in factory floor and other automation computing applications. It is able to work in temperatures ranging from 0°C ~ 60°C with anti-shock hard drive mounts, and ruggedized cable-free board assembly to protect against system failure. The unique modular-concept construction of the EC300 product line enables DFI to offer 12 different off-the-shelf models, insuring a wide-range of quick-turn system assemblies for our distributors, integrators and OEM customers.
This low-power industrial system is ideal for applications requiring a stable revision-controlled platform with flexible system configuration, such as industrial control, factory floor automation, smart grid & power generation, and building automation.
• Intel® Core™ i7-3610QE, i5-3610ME, and i3-3120ME processors
• Intel® QM77 Express chipset
• Up to 16GB DDR3 1066/1333MHz memory
• Fanless, passive heatsink cooling
• Single 16-30V DC power input, with AC adapter
• VESA and Wall mounting
• Up to 2 2.5" SATA HDD bays
• 1 CompactFlash socket
• 1 mSATA module via the Mini PCIe slot
• 1 Mini PCIe expansion card slot
• 2 Wi-Fi module antenna mounting holes
• 2-channel Analog and HD Audio support
• Temperature: Operating 0°C to 60°C, Storage -20°C to 70°C
• Certifications: UL, CE and FCC Class B approvals
• EC300: 1 Mini PCIe
• EC310: 1 PCI, 1 Mini PCIe
• EC320: 2 PCI, 1 Mini PCIe
• EC321: 1 PCI, 1 PCIe x1, 1 Mini PCIe
• EC3xx-CR6880: 1 VGA, 2 LAN, 6 COM, 8-bit GPIO, 8 USB
• EC3xx-CR6G60: 1 VGA, 2 LAN, 6 COM, 16-bit GPIO, 6 USB
• EC3xx-CRA060: 1 VGA, 2 LAN, 10 COM, 6 USB
All product specifications are subject to change without notice.
Intel® and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an email: firstname.lastname@example.org
For more information on the EC300 Series Embedded System, please visit: www.dfi.com
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 30 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI® uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Intelligent Systems Alliance, DFI® works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.