CS650-Q370｜Intel®｜工业级主机板｜友通资讯 DFI

8th Generation Intel® Core™ /Pentium®/Celeron® LGA 1151 Socket Processors, TDP support up to 95W:
Intel® Core™ i7-8700 (6 Cores, 12M Cache, up to 4.6 GHz); 65W
Intel® Core™ i7-8700T (6 Cores, 12M Cache, up to 4.0 GHz); 35W
Intel® Core™ i5-8500 (6 Cores, 9M Cache, up to 4.1 GHz); 65W
Intel® Core™ i5-8500T (6 Cores, 9M Cache, up to 3.5 GHz); 35W
Intel® Core™ i3-8100 (4 Cores, 6M Cache, 3.6 GHz); 65W
Intel® Core™ i3-8100T (4 Cores, 6M Cache, to 3.1 GHz); 35W
Intel® Pentium® G5400 (2 Cores, 4M Cache, 3.7 GHz); 58W
Intel® Pentium® G5400T (2 Cores, 4M Cache, 3.1 GHz); 35W
Intel® Celeron® G4900 (2 Cores, 2M Cache, 3.1 GHz); 54W
Intel® Celeron® G4900T (2 Cores, 2M Cache, 2.9 GHz); 35W

9th Generation Intel® Core™ LGA 1151 Socket Processors, TDP support up to 95W:
Intel® Core™ i7-9700E (8 Cores, 12M Cache, up to 4.4 GHz); 65W
Intel® Core™ i7-9700TE (8 Cores, 12M Cache, up to 3.8 GHz); 35W
Intel® Core™ i5-9500E (6 Cores, 9M Cache, up to 4.2 GHz); 65W
Intel® Core™ i5-9500TE (6 Cores, 9M Cache, up to 3.6 GHz); 35W
Intel® Core™ i3-9100E (4 Cores, 6M Cache, 3.7 GHz); 65W
Intel® Core™ i3-9100TE (4 Cores, 6M Cache, to 3.2 GHz); 35W

Intel® Q370 Chipset

Four 288-pin DIMM up to 128GB
Dual Channel DDR4 2400/2666 MHz

AMI SPI 128Mbit

Intel® HD Gen 9 Graphics

OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9

1 x VGA
2 x DP++
VGA: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2160 @ 60Hz

VGA + DP++ + DP++

1 x Full-sized Mini PCIe (PCIe/SATA/USB2.0), share with SATA 3(R5)
1 x M.2 2242/2260/2280 M key (PCIe Gen3 x 4 NVMe/SATA)
2 x PCIe x16 (Gen 3) (1 x16 signal or 2 x8 signals)
3 x PCIe x4 (Gen 3)
1 x PCIe x1 (Gen 3)
1 x PCI

Realtek ALC888

1 x Intel® I210AT PCIe (10/100/1000Mbps)
1 x Intel® I219LM PCIe with iAMT12.0 (10/100/1000Mbps) (only Core i7/i5 supports iAMT)

2 x GbE (RJ-45)

1 x RS-232/422/485 (RS-232 w/ power) (DB-9)

2 x USB 3.1 Gen 2
2 x USB 3.1 Gen 1
2 x USB 2.0

1 x PS/2 (mini-DIN-6)

1 x VGA
2 x DP++

1 x Line-out
1 x Mic-in
1 x Line-in (opt., MOQ required)

1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
4 x RS-232 (2.54mm pitch)

2 x USB 3.1 Gen 1 (2.00mm pitch)
4 x USB 2.0 (2.54mm pitch) (1 x USB 2.0 colay vertical Type A) (opt., MOQ required)

1 x Front Audio Header
1 x S/PDIF

4 x SATA 3.0 (up to 6Gb/s, SATA 3(R5) shared with mini PCIe (SATA), default at mini PCIe)
RAID 0/1/5/10

1 x 8-bit DIO

1 x LPC (support LPC EXT-RS-232/485 module)

1 x SMBus

System Reset, Programmable via Software from 1 to 255 sec/min

Infineon TPM 2.0 (Available Upon Request, MOQ required)

ATX

8-pin ATX 12V power
24-pin ATX power

Typical: i7-8700K: 3.3V @ 0.34A (1.122Watt); 5V @ 0.58A (2.9Watt); 12V @ 0.65A (7.8Watt)
Max.: i7-8700K:3.3V @ 0.52A (1.716Watt); 5V @ 1.27A (6.35Watt); 12V @ 13.01A (156.12Watt)

CR2032 Coin Cell

Windows 10 IoT Enterprise 64-bit
Linux

Operating: -5 to 65°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery

Operating: 5 to 95% RH
Storage: 5 to 95% RH

534,017 hrs @ 25°C; 298,488 hrs @ 45°C ; 184,547 hrs @ 60°C ; 133,068 hrs @ 70°C
Calculation Model: Telcordia Issue 4
Environment: GB, GC - Ground Benign, Controlled

ATX Form Factor
305mm (12") x 244mm (9.6")

PCB: 1.6mm
Top Side: 32mm Bottom Side: 4.4mm

CE, FCC Class B, RoHS, KC, UL

1 CS650-Q370 motherboard
1 COM port cables (Length: 300mm, 2 x COM ports) A81-015026-023G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
1 I/O shield A49-CS6310-000G
1 mini PCIe screw A32-112016-041G