Name: ICD970
Brand: DFI

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产品型录

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ICD970

产品概要

首页嵌入式电脑模块 COM Express Basic ICD970

3rd Gen Intel® Xeon® Processor D-1700 Family

Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB, 3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz)

Support extended operating temperature: -40 to 85°C

10GBASE-KR: Support up to 4 x 10GbE Mac ports

Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX)

Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0

15-Year CPU Life Cycle Support Until Q1' 37 (Based on Intel IOTG Roadmap)

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系统

处理器

3rd Gen Intel® Xeon® Scalable Processors D-1700 Family
Intel® Xeon® D-1746TER Processor, 10 Cores, 15MB Cache, 2.0GHz, 67W
Intel® Xeon® D-1735TR Processor, 8 Cores, 15MB Cache, 2.2GHz, 59W
Intel® Xeon® D-1732TE Processor, 8 Cores, 15MB Cache, 1.9GHz, 52W
Intel® Xeon® D-1715TER Processor, 4 Cores, 10MB Cache, 2.4GHz, 50W
Intel® Xeon® D-1712TR Processor, 4 Cores, 10MB Cache, 2.0GHz, 40W

内存

Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB
3rd DIMM by request
(SDPC mode by request to support DDR4 2933MHz)

BIOS

Insyde SPI 512Mbit

扩充

界面

Default:
B1: 1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3)
B2: 1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3)
B3/B4: 1 x PCIe x16 or 2 x PCIe x8 or 4x PCIe x4 (Gen 4)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)

以太网路

控制器

Supports up to 4 x 10GBASE-KR interfaces and max up to 4 x 10GbE MAC ports (maximum bandwidth 40Gb by activating the 4 x 10GbE at the same time)
1 x Intel® I210AT (10/100/1000Mbps) (0 to 60°C) or
1 x Intel® I210IT (10/100/1000Mbps) (-40 to 85°C)

输入/输出

USB

4 x USB 3.0
4 x USB 2.0

SATA

2 x SATA 3.0 (up to 6Gb/s)

DIO

1 x 8-bit DIO (4 in, 4 out)

监视定时器

看门狗定时器

System Reset, Programmable via Software from 1 to 255 Seconds

安全性

信赖平台模块

Default TPM2.0, fTPM by request

电源

类型

12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)

耗能

Typical: 71.36W
Max: 72.36W

支持操作系统

微软

Windows Server 2019, 2022

Linux

Ubuntu 20.04, CentOS 7.5

环境指标

温度

Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C

湿度

Operating: 5 to 90% RH
Storage: 5 to 90% RH

MTBF

277,731hrs @25°C; 144,676hrs @45°C; 81,589hrs @60°C; 55,811hrs @70°C; 37,526 @85°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled

机械结构

尺寸

COM Express® Basic
95mm (3.74") x 125mm (4.9")

规范

PICMG COM Express® R3.0, Type 7

安规认证

认证

CE, FCC, RoHS

装箱单

1 ICD970 board
1 Cooler (Height: 47.80 mm) 0 to 60°C: TBD / -40 to 85°C: TBD

产品资料

嵌入式电脑模块产品型录 (PDF) 11.75MB 2024/03/05

ICD970 规格书 (PDF) 1.13MB 2023/10/20

工业计算机产品型录 - 简中 (PDF) 20.09MB 2022/07/01

技术文件

ICD970 使用者手册 (PDF) 2.83MB 2023/10/20

ICD970｜Intel®｜嵌入式电脑模块｜友通资讯 DFI

ICD970 产品概要

3rd Gen Intel® Xeon® Processor D-1700 Family

Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB, 3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz)

Support extended operating temperature: -40 to 85°C

10GBASE-KR: Support up to 4 x 10GbE Mac ports

Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX)

Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0

15-Year CPU Life Cycle Support Until Q1' 37 (Based on Intel IOTG Roadmap)

ICD970 Feature

宽温: -40~85°C

PCIe x16扩充插槽

修正错误内存

多元扩充插槽

10Gb以太网络

DDR4内存

ICD970 认证书

RoHS 认证

CE 认证

FCC 认证

ICD970 相关标签

IoT

Intel

5G

无风扇设计

PCIe x16扩充插槽

Windows

Linux

多元扩充插槽

10Gb以太网络

DDR4内存

RoHS认证

CE认证

FCC认证

高效能

医疗

Intel® 第三代 至强 Ice Lake-SP 处理器

ICD970 相关资源

ICD970 相关产品

DV970

与友通合作

Intel® 第三代至强 Ice Lake-SP 处理器

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