We have noticed that you are visiting from North American areas. Would you like to browse the US site (US.DFI.com) for a better experience?

Würden Sie an einer kurzen Umfrage teilnehmen?

Vielen Dank für Ihre Teilnahme an dieser Umfrage. Ihre Rückmeldung hilft uns bei der Verbesserung unserer offiziellen Website und der Bereitstellung eines besseren Nutzererlebnisses.

Ihre Rückmeldung wurde erfolgreich versendet. Vielen Dank für Ihre Teilnahme.

Schließen
Über DFI Presseraum DFI QB702-B Qseven Module Supports Wide Temperature from -40 to 85°C
Produktneuigkeiten

DFI QB702-B Qseven Module Supports Wide Temperature from -40 to 85°C|Presseraum|DFI

DFI QB702-B Qseven Module Supports Wide Temperature from -40 to 85°C

2013/02/05 (UTC+1)

DFI today announces the QB702-B, a new wide temperature Qseven form factor module in its Intel® Atom E6x0T product line. This new Qseven module supports the Intel® Atom E620T, E640T, E660T, and E680T processors that feature 45-nanometer process technology with integrated system memory and graphics processing to provide higher performance.The Intel® Graphics Media Accelerator (GMA) 600 graphics engine supports ultra-low power 3D graphics with high definition hardware video decoder and encoder engine to provide the perfect imaging capability up to 400MHz graphics. LVDS and SDVO graphics interfaces provide dual independent display support up to 1280x768 @ 60Hz and 1280x1024 @ 85Hz resolutions, respectively.The new Qseven module supports Intel® Hyper-Threading Technology, which enables each processor core to handle two instruction threads and dynamically increase the clock speed when all cores are not fully utilized. This provides higher performance at reduced power consumption across a broad-spectrum of embedded processing applications.


The expansion design of this platform supports 1 Gigabit Ethernet LAN controller for high speed networking, 2 Serial ATA 2.0 ports with speed up to 3Gb/s, 7 USB 2.0 host controller, 1 USB 2.0 Host/Client, HD audio, 3 PCIe x1 interfaces, 1 CAN-bus, and 1 SDIO/MMC interface. The DDR2 onboard comes available in 1GB. This low power module also offers 32GB onboard SSD storage device in the QB702-B.Compared to the QB701-B, the QB702-B Qseven module additionally offers one Express Card and 8-bit DIO interface. In addition, the QB702-B also provides wide temperature support from -40°C to 85°C making it suitable for various environments.The features of this QB702-B embedded module are perfect for a wide range of applications requiring a stable revision-controlled platform, such as industrial control automation, kiosk, medical devices, and gaming machines.

 

QB702-B Qseven Module Features:


• Qseven form factor (70mm x 70mm)
• Supports Intel® Atom E620T/E640T/E660T/E680T CPU processors
• Intel® EG20T PCH Chipset
• Up to 1GB DDR2 onboard, single 32-bit channel memory
• Integrated Intel® GMA 600 graphics supports 1280x768 LVDS and
  1280x1024 SDVO dual independent displays interfaces
• 1 Gigabit Ethernet LAN controller
• 2 Serial ATA interfaces (3Gb/s)
• 7 USB 2.0 Host
• 1 USB 2.0 Host/Client (Selectable)
• 3 PCIe x1
• 1 CAN-bus
• 1 ExpressCard (PCIe signal only)
• 8-bit DIO interface
• SDIO/MMC interface (class 6)
• 2GB/4GB/8GB/16GB/32GB SSD onboard
• Operating Temperature: -40oC to 85 oC


All product specifications are subject to change without notice.Intel® and Atom™ are registered trademarks of the Intel Corporation in the U.S. and other countries.For more information, please call DFI sales or send us an email:inquiry@dfi.comFor more information on the QB702-B Qseven Module, please visit:www.dfi.com

 

About DFI 

Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI® uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Intelligent Systems Alliance, DFI® works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.


DFI Inc.

100, Huanhe St., Xizhi Dist.,
New Taipei City 22154, Taiwan (R.O.C.)
Tel: +886 (2) 2694-2986
Fax: +886 (2) 2694-5815
Sales E-Mail: inquiry@dfi.com
Website: https://www.dfi.com