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M8MP553|NXP|Industrie-Motherboards|DFI

M8MP553
Home Industrie-Motherboards 3,5-Zoll-SBC M8MP553
  • NXP i.MX8M plus Processors: 30% performance enhancement
  • Wide Voltage Support 9~36VDC
  • 2 GbE LAN for automation application
  • CAN bus for automation equipments integration
  • M.2 2230/3052: 1 M.2 B key for PCIe
  • 15-Year CPU Life Cycle Support Until Q1' 36 (Based on NXP Roadmap)

Status : Muster Verfügbar Jetzt Angebot machen

Breiter Spannungsbereich: 9~36V DC-in
Lüfterloses Design
4K2K-Anzeige
Android
Mehrfache Erweiterung
DDR4
Breiter Temperaturbereich: -30~85°C
Produktvergleich
Sie haben Artikel. ,Up to 3 items.
Jetzt vergleichen
Angebot
Sie haben ,Up to 3 items.
Jetzt Angebot machen
RoHS Zertifizierungen
CE Zertifizierungen
FCC Zertifizierungen

M8MP553 Verwandte Tags

#IoT#5G#ARM#Lüfterloses Design#Kompakte Größe#4K2K-Anzeige#Linux#Android#HDMI#Mehrfache Erweiterung#DDR4#Geringer Stromverbrauch#NXP i.MX 8M
M8MP553
M8MP553
M8MP553
M8MP553
System
Prozessor
i.MX 8M plus applications processors
MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz, VPU/ISP/CAN FD, -40~105°C
MIMX8ML3CVNKZAB (Industrial), Dual 1.6GHz, VPU/ML/ISP/CAN FD, -40~105°C
Speicher
2GB/4GB/8GB LPDDR4 Memory Down
Grafik
Controller
GC7000UL
Merkmal
HW Decode: 1080p60 H.265,H.264, VP9, VP8
HW Endcode: 1080p60 H.265,H.264
Anzeige
1 x HDMI
1 x LVDS
HDMI: resolution up to 1920x1080 @60Hz
LVDS: resolution up to 1920x1200 @60Hz
Dualanzeige
LVDS + HDMI
Andriod:support single output
Speicher
eMMC
1 x eMMC 5.1 with default 16GB (up to 64GB)
Erweiterung
Schnittstelle
1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0/PCIe x1)
1 x M.2 E key 2230 (PCIe x1/USB 2.0)
1 x Nano SIM slot
Audio
Audiocodec
Audio codec SGTL5000
Ethernet
PHY
AR8035
I/O Rückseite
Ethernet
2 x GbE (RJ-45)
Seriell
1 x RS485 (2-wire)
USB
2 x USB 3.1 Gen1
2 x USB 2.0
Anzeige
1 x HDMI
I/O Innenseite
Seriell
1 x RS232
1 x RS232/422/485 (2.0mm pitch)
USB
2 x USB 2.0 (2.00mm pitch, the 2nd USB is opt. from M.2 3052)
1 x Micro USB OTG
Anzeige
1 x LVDS LCD Panel connector
1 x LCD/Intverter Power
Audio
1 x Audio (Line-out/Mic-in)
DIO
1 x 8-bit DIO
SD
1 x uSD card
CANBus
2 x CAN bus 2.0b on Industrial CPU sku
I2C
1 x I2C
1 x PWM
Watchdog
Ausgabe und Intervall
System Reset, Programmable via Software from 1 to 255 Seconds
Leistung
Typ
Wide Range 9~36VDC
Anschluss
2-pole terminal block (default)
Co-lay 4-pin vertical power connector
Verbrauch
Typical: i.MX 8M Plus Quad, 12V, 3.6Watt
Max.: i.MX 8M Plus Quad, 12V, 5.28Watt
Akku
CR2032 Coin Cell
Betriebssystemunterstützung
Linux
Linux Yocto 3.0 (default)
Software
Android 10
Umgebung
Temperatur
Operating: -5 to 65°C, -30 to 80 °C
Storage: -40 to 85°C
Feuchtigkeit
Operating: 5 to 90% RH
Storage: 5 to 90% RH
Mittlere Betriebsdauer zwischen Ausfällen
i.MX 8M Plus Quad: 632,710 hrs @ 25°C; 386,370 hrs @ 45°C ; 252,204 hrs @ 60°C; 138,544 hrs @ 80°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanismus
Abmessungen
3.5" SBC Form Factor
146mm (5.75") x 102mm (4.02")
Höhe
PCB: 1.6mm
Top Side: 15mm
Bottom Side: 4mm
Standards und Zertifizierungen
Zertifizierungen
CE, FCC, RoHS
Packliste
Packliste
1 M8MP553 board
1 Terminal block for RS485 (COM3) 342-361021-000G
1 Heatsink (Height: 21mm) A71-008168-000G
Country of Origin
Country of Origin
Taiwan
Bestellinformationen
  • Modellbezeichnung Teilenummer Beschreibung
  • Modellbezeichnung :
    M8MP553-ECC-41QDI
    Teilenummer :
    770-8MP5531-200G
    Beschreibung :
    Quad Core Processor, 4 GB Memory Down, eMMC 16 GB, 2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0, Power 9~36VDC, fanless design, -30 to 80°C
  • Modellbezeichnung :
    M8MP553-ECC-21DLI
    Teilenummer :
    770-8MP5531-300G
    Beschreibung :
    Dual Core Processor, 2 GB Memory Down, eMMC 16 GB, 2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0, Power 9~36VDC, fanless design, -30 to 80°C
  • Modellbezeichnung :
    M8MP553-ECC-81QDI
    Teilenummer :
    770-8MP5531-400G
    Beschreibung :
    Quad core Processor, 8 GB Memory Down, eMMC 16 GB, 2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0, Power 9~36VDC, fanless design, -30 to 80°C
Optionale Artikel
  • Artikelname Teilenummer Beschreibung
  • Artikelname :
    2 pole terminal to DC jack cable
    Teilenummer :
    A81-004013-000G
    Beschreibung :
  • Artikelname :
    Power adapter
    Teilenummer :
    671-106012-000G
    Beschreibung :
    60W, 12V, DC Jack
  • Artikelname :
    USB 2.0 cable
    Teilenummer :
    A81-001032-016G
    Beschreibung :
    Length: 200mm
  • Artikelname :
    COM port cable
    Teilenummer :
    A81-009595-016G
    Beschreibung :
    Length: 250mm, COM1/4
  • Artikelname :
    Audio
    Teilenummer :
    A81-022031-016G
    Beschreibung :
    Length: 300mm
  • Artikelname :
    Heat spreader
    Teilenummer :
    TBD
    Beschreibung :
    Height: 11mm
  • Artikelname :
    Debug console with cable
    Teilenummer :
    770-IMX8M1-000G
    Beschreibung :
    Length: 500mm

Empowering Machine Learning at the Edge

With 3.5” form factor SBC iMx8M plus-based solution, M8MP553 is powered by dual core to quad core 64bit 1.8GHz Arm® Cortex-A53 processor for real-time tasks, improving overall performance by 30% compared to previous generation.

Unparalleled Performance with ARM® i.MX8M plus Processors

Built-in low-power processors, M8MP553 is designed for complex compute tasks and delivers superior image and AI inferencing capabilities. It empowers industrial edge with low latency, power efficiency, and advanced precision. M8MP553 is applicable to meet the needs of intelligent applications including object recognition and detection for Industrial Automation, Medical, and Smart City Infrastructure.

Superior Visual Capability

i.MX8M plus processor is integrated with neural network processing unit (NPU). It is designed from the ground up to execute deep learning inference, and to outperform CPU- and GPU-based solutions in the same power range by several times. The NPU embedded in the I.MX 8M plus helps users that need AI function to add value to their industrial robotics or in-vehicle application, and it enhances M8MP553 with superior multimedia capabilities include video encoding and decoding, 2D/3D graphic acceleration, and multiple audio and voice functionalities.

Flexible I/O Tailored Fast Computing at the Edge

M8MP553 solution delivers a richer I/O, multiple interfaces, and performance enhancement with cost-efficiency simultaneously. Along with other expansion interfaces designed for high-end flaw detection and imaging, M8MP553 provides great flexibility and scalability for Edge AI applications.

Ultra-High-Speed Connectivity for Edge AI

For high precision computing devices for flaw detection and machine vision, the 4G/5G edge gateway can quickly handle the transmission of high-resolution images, accelerating M2M communication.

Outstanding Graphic Performance

M8MP553 equipped with iM8M plus processor delivers advanced 4K performance. It supports LVDS and HDMI with dual display visual for applications such as facial recognition, object detection, machine vision, and digital signage.

Industry-Leading Wide Voltage and Temperature Endurance

M8MP553 supports ultra-wide voltage support with 9-36V to provide operation stability. In addition, with advanced wide operating temperature range from -30C to 80C, M8MP553 satisfies the need of industries in harsh environment and outdoor applications, especially for smart city infrastructure, industrial automation, charging station applications.

Industrial-grade Long Term Support

Long life cycle support, no risk occurred. With product life support up to 15 years, DFI guarantees the performance, quality and future repair and replacement

Mit DFI arbeiten

DFIs Anpassungsdienste werden von einem speziellen Team mit umfassendem Support und Branchenkompetenz bereitgestellt, das Ihnen exklusiven Service in puncto Design, Produktion, Garantie, Reparaturen und Lebenszyklusmanagement bietet. Damit das Projekt für Sie so einfach wie möglich vonstattengeht, arbeitet DFI eng mit Ihnen an der Ausarbeitung Ihrer Designanforderungen und bietet laufend technischen Support, während Sie Ihre Lösung entwickeln – dies spart Entwicklungskosten und senkt Ihren Arbeitsaufwand.

Erste Schritte