We have noticed that you are visiting from North American areas. Would you like to browse the US site (US.DFI.com) for a better experience?

このアンケートにご協力いただきありがとうございます。ご意見は、公式のウェブサイトを改善し、より良いユーザーエクスペリエンスを提供することに役立ちます。

あなたの意見は正常に送信されました。 ご協力に感謝します。

閉じる
概要 プレスルーム Upgrade your Embedded System with DFI’s 6th Gen Intel Core Processor-based COM Express Type 6
製品ニュース

Upgrade your Embedded System with DFI’s 6th Gen Intel Core Processor-based COM Express Type 6|プレスルーム|DFI

Upgrade your Embedded System with DFI’s 6th Gen Intel Core Processor-based COM Express Type 6

2015/12/16 (UTC+9)

DFI, a leading provider offering a wide range of embedded products for industrial applications, today introduces its latest three COM Express Type 6 modules powered by the 6th Generation Intel® Core™ processor family (codename Skylake), including Intel® Mobile-based Basic – SH960-QM170 and SH960-HM170, and U series SoC-based Compact – SU968. The Mobile-based modules features enhanced graphics performance and high computing while ULT-based module features low power and fanless design making them well suited for industrial application in gaming, medical, digital signage, and factory automation.

 

The Mobile-based Module with High-Performance Graphics for Gaming Application

With more and more requirements in the gaming market, gaming machine manufacturers continue to search for the right solution to obtain rich immersive graphics and performance that end users come to expect today. Aimed at the application, DFI developed COM Express Basic based on mobile platform featuring super-fast 2133 DDR4 memory up to 32 GB for faster data transfer and 3 independent displays with high resolution (HDMI/DP++/eDP supports up to 4K x 2K) for greater gaming experience.

 

The ULT-based Module with High-Resolution Output and Low Power Design for Ultrasound Application

Ultrasound imaging devices are widely used in tumor treatment and the practice of examining pregnant women nowadays. In order to meet the growing demands in the medical field, DFI SU968 provides a low-power 15W TDP with fanless design featuring and high-performance 6th generation Intel Core processor that supports high-resolution output to boost graphics capability in ultrasound application.

 

Computer-On-Module is one of the popular choices for machine manufacturers and system integrators to design application-specific solutions. In order to reduce our customers’ development time and work, DFI provides time-to-market standard COM Express as well as OEM/ODM customized services, including module design assistance and evaluation during planning phase, strict validation and testing process for deployments, and customized COM Express thermal solution design for special requirements. With more than 34 years of professional experience in research, design and manufacture, DFI can handle those complex technical issues and become your reliable partner.” said Victor Huang, Product Manager at DFI.

 

Contact Us

DFI Inc.

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)

 +886 (2) 2697 2986   inquiry@dfi.com  

 

DFI-ITOX, LLC

197 Route 18 South, STE 108, East Brunswick, NJ 08816, USA

 +1 (732) 390 2815   www.dfi-itox.com/estore

 

DFI B.V.

Klompenmakerstraat 89, 3194 DD Rotterdam-Hoogvliet, The Netherlands

 +31 (10) 296 1840

 

DFI Co., Ltd.

5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan

 +81 (3) 5209 1081

 

Yan Ying Hao Trading Co. Ltd. (ShenZhen)

Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building,

Bao'an Road, Bao'an 42th District, ShenZhen, China

 +86 (0755) 2372 9390