We have noticed that you are visiting from North American areas. Would you like to browse the US site (US.DFI.com) for a better experience?

Thank you for taking this survey. Your feedback will help us improve our official website and provide a better user experience.

Your feedback has been successfully submitted. Thank you very much for your time and participation.

Close

SH960-HM170|Intel®|System-On-Modules|DFI

SH960-HM170
Home System-On-Modules COM Express Basic SH960-HM170
  • 6th Gen Intel® Core™, Intel® HM170 Chipset
  • Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
  • Multiple expansion: 1 PCIe x16, 8 PCIe x1
  • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
  • Dual channel DDR4 2133MHz SODIMM up to 32GB
  • 15-Year CPU Life Cycle Support Until Q1' 31 (Based on Intel IOTG Roadmap)

Status : Launched QUOTE NOW

Wide-temp: -40°C~85°C
4K2K Display
PCIe x16
DDR4
Triple Independent Display
Product Comparison
You have items. ,Up to 3 items.
COMPARE NOW
Quotation
You have ,Up to 3 items.
QUOTE NOW
RoHS Certification
CE Certification
FCC Certification

SH960-HM170 Related Tags

#IoT#Intel#4K2K Display#1G Ethernet#PCIe x16#Windows#Linux#HDMI#VGA#DP#DDR4#RoHS Certification#CE Certification#FCC Certification
COM Express Type 6, SH960-HM170
COM Express Type 6, SH960-HM170
COM Express Type 6, SH960-HM170
System
Processor
6th Generation Intel® Core™ Processors, BGA 1440
Intel® Core™ i7-6820EQ Processor, Quad Core, 8M Cache, 2.8GHz (3.5GHz), 45W
Intel® Core™ i7-6822EQ Processor, Quad Core, 8M Cache, 2.0GHz (2.8GHz), 25W
Intel® Core™ i5-6440EQ Processor, Quad Core, 6M Cache, 2.7GHz (3.4GHz), 45W
Intel® Core™ i5-6442EQ Processor, Quad Core, 6M Cache, 1.9GHz (2.7GHz), 25W
Intel® Core™ i3-6100E Processor, Dual Core, 3M Cache, 2.7GHz, 35W
Intel® Core™ i3-6102E Processor, Dual Core, 3M Cache, 1.9GHz, 25W
Intel® Celeron® Processor G3900E, Dual Core, 2M Cache, 2.4GHz, 35W
Intel® Celeron® Processor G3902E, Dual Core, 2M Cache, 1.6GHz, 25W
Chipset
Intel® HM170 Chipset
Memory
Two 260-pin SODIMM up to 32GB Dual Channel DDR4 2133MHz
BIOS
Insyde SPI 128Mbit
Graphics
Controller
Intel® HD Graphics GT Series
Feature
OpenGL up to 4.4, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display
1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 1920x1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz or 2560x1600 @ 60Hz
DVI: resolution up to 1920x1200 @ 60Hz
DP++/eDP: resolution up to 4096x2304 @ 60Hz
Triple Displays
VGA + LVDS + DDI or VGA + DDI1 + DDI2
eDP + 2 DDI (available upon request)
Expansion
Interface
1 x PCIe x16 or 2 x PCIe x8 (Gen 3)
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® I219LM with iAMT11.0 PCIe (10/100/1000Mbps)
I/O
USB
4 x USB 3.0
8 x USB 2.0
SATA
4 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10
DIO
1 x 8-bit DIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
Available Upon Request
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption
"Typical: 12V @ 2.3850A (28.62Watt)
Max.: 12V @ 5.842A (70.104Watt)"
OS Support
OS Support
Windows 7 (/WES7) 32/64-bit
Windows 8.1 (64-bit)
Windows 10 IoT Enterprise 64-bit
Debian 8 (with VESA graphic driver)
CentOS 7 (with VESA graphic driver)
Linux
Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
663,394hrs @ 25°C; 334,612 hrs @ 45°C; 193,307 hrs @ 60°C excluding accessories
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
COM Express® Basic 95mm (3.74") x 125mm (4.9")
Compliance
PICMG COM Express® R2.1, Type 6
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
1 SH960-HM170 board
1 Cooler (Height: 36.58mm): A71-111026-000G
Country of Origin
Country of Origin
Taiwan
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    SH960-HM170TS-6100E
    Part Number :
    770-SH9604-800G
    Description :
    Cooler, Intel Core i3-6100E, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C

* Core i3 and Celeron are supported upon request with MOQ requirement.

Optional Items
  • Item Name Part Number Description
  • Item Name :
    Heat spreader
    Part Number :
    A71-011073-000G
    Description :
    Height: 11mm
  • Item Name :
    COM332-B carrier board kit
    Part Number :
    770-CM3321-000G
    Description :

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

Get Started