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CS181-H310|Intel®|Industrial Motherboards|DFI

Home Industrial Motherboards Mini-ITX CS181-H310
  • 8th/9th Generation Intel® Core™ Processors
  • 2 DDR4 2400/2666MHz SODIMM up to 64GB
  • Multiple Displays: 1 eDP, 1 DP++/HDMI (autodetection), 4 DP (MXM)
  • Supports up to 4K/2K resolution
  • Multiple Expansions: 1 MXM Type-A/B/B+/C, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
  • Storage: 2 SATA 3.0
  • Rich I/O: 4 Intel GbE, 2 COM, 4 USB 3.2 Gen1, 2 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1' 35 (Based on Intel IOTG Roadmap)

Status : Launched BUY ONLINE (US)

4K2K Display
Multiple Expansion
Product Comparison
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You have ,Up to 3 items.
RoHS Certification
CE Certification
FCC Certification

CS181-H310 Related Tags

#MXM#NVIDIA AI#IoT#Intel#4K2K Display#Windows#Linux#HDMI#DP#Multiple Expansion#DDR4#RoHS Certification#CE Certification#FCC Certification
Mini-ITX Motherboard Front
Mini-ITX Motherboard Back
Mini-ITX Motherboard Side
Mini-ITX Motherboard I/O
9th Generation Intel® Core™ Processors, LGA 1151 Socket, TDP up to 65W
Intel® Core i7-9700E Processor (Core 8; Max speed 4.4 GHz; TDP 65W)
Intel® Core i7-9700TE Processor (Core 8; Max speed 3.8 GHz; TDP 35W)
Intel® Core i5-9500E Processor (Core 6; Max speed 4.2 GHz; TDP 65W)
Intel® Core i5-9500TE Processor (Core 6; Max speed 3.6 GHz; TDP 35W)
Intel® Core i3-9100E Processor (Core 4; Max speed 3.7 GHz; TDP 65W)
Intel® Core i3-9100TE Processor (Core 4; Max speed 3.2 GHz; TDP 35W)
8th Generation Intel® Core™ Processors, LGA 1151 Socket, TDP up to 65W
Intel® Core™ i7-8700 Processor (Core 6; Max speed 4.6 GHz; TDP 65W)
Intel® Core™ i7-8700T Processor (Core 6; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500 Processor (Core 6; Max speed 4.1 GHz; TDP 65W)
Intel® Core™ i5-8500T Processor (Core 6; Max speed 3.5 GHz; TDP 35W)
Intel® Core™ i3-8100 Processor (Core 4; Max speed 3.6 GHz; TDP 65W)
Intel® Core™ i3-8100T Processor (Core 4; Max speed 3.1 GHz; TDP 35W)
Intel® Pentium G5400 Processor (Core 2; Max speed 3.7 GHz; TDP 58W)
Intel® Celeron G4900 Processor (Core 2; Max speed 3.1 GHz; TDP 54W)
Intel® H310 Chipset
Two 260-pin SODIMM up to 64GB
Dual Channel DDR4 2400/2666MHz
AMI SPI 128Mbit
Intel® UHD Graphics 630 (Pentium G5400 and Celeron G4900 support Intel® UHD Graphics 610)
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
1 x eDP
1 x DP++/HDMI (auto-detection)
4 x DP (support by MXM Type-A/B module)
eDP: resolution up to 4096x2304 @ 60Hz
DP: resolution up to 4096x2304 @ 60Hz
HDMI: resolution up to 4096x2160 @ 30Hz
Multiple Displays
Onboard: eDP + DP++/HDMI
Onboard+MXM module: eDP + DP++/HDMI + DP + DP + DP + DP
1 x MXM Type-A/B/B+/C (support MXM module) (provide 4 x independent DP at rear side)
1 x M.2 2280 M Key (PCIe Gen2 x1)
1 x M.2 3042/3052 B Key (SATA 3.0)
1 x M.2 2230 E Key (USB2.0/PCIe x1 Gen2) (support BT/Wi-Fi module)
Audio Codec
Realtek ALC888S-VD2-GR
1 x Intel® I219V PHY (10/100/1000Mbps)
3 x Intel® I210AT PCIe (10/100/1000Mbps)
Rear I/O
4 x GbE (RJ-45)
4 x USB 3.2 Gen1 (dual type-A connector)
1 x DP++/HDMI (auto-detection)
1 x DC Jack (mini-DIN)
Internal I/O
2 x RS232/RS422/RS485, Select by BIOS
2 x USB 2.0 (2 x 5 10-pin 2.00mm pitch header)
1 x eDP
1 x LCD/Inverter Power
1 x Front Audio (2 x 5 10-pin 2.00mm pitch header)
2 x SATA 3.0 (up to 6Gb/s)
1 x 8-bit DIO (1 x 8 8-pin 2.00mm pitch header)
1 x DIO Power (1x 4 4-pin 2.00mm pitch header)
1 x LPC (2 x 7 14-pin 2.00mm pitch female header)
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
dTPM2.0 (default)
Single 19V +/-5% DC
DC-in Jack (mini-DIN)
Idle: i7-8700 65W: 19V @ 0.91A (17.29W)
Max: i7-8700 65W: 19V @ 7.34A (139.46W)
RTC Battery
CR2032 Coin Cell
OS Support
Windows 10 IoT Enterprise 64-bit
Operating: -5 to 65°C
Storage: -40 to 85°C
Operating: 5 to 90% RH
Storage: 5 to 90% RH
538,449 hrs @ 25°C; 324,118 hrs @ 45°C; 213,302 hrs @ 60°C;
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
195mm (7.7") x 170mm (6.7")
PCB: 1.6mm
Top Side: 26mm, Bottom Side: 10mm
Standards and Certifications
Packing List
Packing List
1 CS181 motherboard
1 Serial ATA data with power cable (Length: 300mm) A81-002013-000G
1 COM port cable (Length: 250mm, 1 COM port) A81-015011-001G
1 USB port cable (Length: 200mm) A81-001032-016G
1 I/O shield A49-CS1811-100G
Country of Origin
Country of Origin
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    Part Number :
    Description :
    2 DDR4 SODIMM, 1 DP++/HDMI, 4 DP++ by MXM,4 Intel GbE, 2 COM, 4 USB 3.2 Gen 1, 2 USB 2.0, 2 SATA 3.0, -5 to 65°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    COM port cable
    Part Number :
    Description :
    Length: 250mm, 1 COM port
  • Item Name :
    Serial ATA data cable
    Part Number :
    Description :
    Length: 500mm
  • Item Name :
    Serial ATA power cable
    Part Number :
    Description :
    Length: 300mm
  • Item Name :
    Thermal solution
    Part Number :
    Description :
    For 35W, Height: 37.3mm
    For 65W, Height: 45.3mm
  • Item Name :
    MXM Quadro P2000
    Part Number :
    Description :
    58W, 0~55°C
  • Item Name :
    MXM Quadro RTX 3000
    Part Number :
    Description :
    80W, 0~55°C
  • Item Name :
    Fan PWR Y-cable for MXM(RTX3000)
    Part Number :
    Description :
    1*3P/2.5mm TO 1*3P/2.54mm to 1*4P/1.25mm, L=50mm
  • Item Name :
    Part Number :
    Description :
    87 x 106.35 x 34mm

Deep Learning at A Small Footprint: CS181 with MXM & 5G module

DFI CS181 is an industrial Mini-ITX motherboard tailored to infuse Deep Learning into smart edge computing. Riding on the solid computing basis of 9th/8th Gen Intel® Core™ i7/i5/i3 processors, CS181 further accelerates graphic processing by MXM for AI vision and machine learning. For edge devices to transfer and receive the analyzed data in order to timely respond to the dynamics at the edge, 5G provides a broadband, high traffic capacity. The closer and faster the synergy between edge devices is, the smarter the edge computing ecosystem is to increase the accuracy in imaging and inspection, or protect the driving safety by traffic flow analysis system or automatic license plate recognition system set on the streets.

Powered By 9th/8th Gen Intel® Core™ Processors

CS181 with 9th/8th Gen Intel® Core™ processors is ideally designed for what’s coming in the new AI era. Integrated with the improved desktop performance multitasked by up to 8 cores, the processor thoroughly releases high-speed computing capacity up to 65W.

Enhanced Accuracy for High-Precision Inspection

High-precision computer vision by small PC is possible now! Condensed the footprint from traditional huge GPU cards to 1/3 of it, the MXM 3.1 module supported by CS181 provides the same level of processing capability with scalable performance up to 200W. Configured with up to 1920 CUDA cores, the MXM module focuses on the visual analysis or compute-intensive workloads that elevates the reliability of production quality for demanding computer vision or AI applications, like AOI, machine vision, vision guided robotics, and AGV in factory automation.

Real-time M2M Communication Based on 5G

Deep learning requires a huge amount of image and data input to achieve smart automation and optimization, and the support for 5G endows CS181 a pair of wings to connect with massive devices and proceed immediate data transmission and analysis. The multi-gigabit speeds and ultra-low latency of 5G strengthen the synergy of devices, and makes communications among a large scale of devices ever seamlessly and efficiently to respond real-time to the dynamics at the edge.

Fantastic Visual Performance

DFI’s completed product series with Intel 8th/9th gen processors & MXM module support have the capability of delivering advanced 4K video experiences with resolution higher than 1080p and high quality UHD streaming media for applications such as computer vision and medical imaging.

Rich Interfaces Promise High Flexibility

To gear up to facilitate the AI trend in industries, CS181 has selected and upgraded key expansion and I/O interfaces for various applications. The improved reading and writing speed supported by 2 DDR4 SO-DIMM up to 64GB and 1 MXM Type-A/B/B+ support, the diverse storage of M.2 (1 M key, 1 B key) and SATA 3.0, wireless connection like Bluetooth/Wifi through M.2 E key and 5G via M.2 B key, and the rich I/O options, such as 2 COM, 4 USB 3.1 Gen2 and 2 USB 2.0, together maximize the flexibility in usage and realize Edge AI ubiquitously.

Enhanced Security Protection

For defending equipment from external threats of security awareness, DFI’s motherboards are available with the advanced feature of iAMT 12.0 for remote management and repair systems. Aside from iAMT 12.0, CS181 is supported with TPM 2.0 for protecting confidential data and improving system integrations.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

Get Started