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TGU171/TGU173|Intel®|Industrial Motherboards|DFI

TGU171/TGU173
Home Industrial Motherboards Mini-ITX TGU171/TGU173
  • 11th Gen Intel® Core™ Processors
  • DDR4 3200MHz SODIMM up to 64GB
  • Quad independent displays: 1 LVDS, 1 eDP, 1 DP++, 1 HDMI, 1 USB Type C
  • Supports up to 4K/2K resolution
  • Multiple expansion: 1 PCIe x4, 1 M.2 M Key, 1 M.2 B key (SATA/PCIe), 1 M.2 E key (USB), 1 Nano-SIM Socket
  • Storage: 2 SATA 3.0
  • Rich I/O: 1 Intel 2.5GLAN, 2 Intel GbE, 4 COM, 4 USB 3.1 Gen2, 1 USB Type-C, 4 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q3' 35 (Based on Intel IOTG Roadmap)

Status : Launched BUY ONLINE (US)

Wide-temp: -40°C~85°C
Wide Voltage: 9~36V DC-in
4K2K Display
Multiple Expansion
Quad Independent Display
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RoHS Certification
CE Certification
FCC Certification
UKCA Certification

TGU171/TGU173 Related Tags

#IoT#Intel#5G#4K2K Display#Windows#Linux#HDMI#DP#Multiple Expansion#DDR4#RoHS Certification#CE Certification#FCC Certification#11th Gen Intel® Tiger Lake Processor#2.5G Ethernet#UKCA Certification
Mini-ITX Motherboard Front
Mini-ITX Motherboard Back
Mini-ITX Motherboard Side
Mini-ITX Motherboard I/O
System
Processor
11th Generation Intel® Core™ Processors
Intel® Core™ i7-1185GRE, Quad Core, 12M Cache, 1.8GHz (4.4GHz), 15~28W
Intel® Core™ i5-1145GRE, Quad Core, 8M Cache, 1.5GHz (4.1GHz), 15~28W
Intel® Core™ i3-1115GRE, Dual Core, 6M Cache, 2.2GHz (3.9GHz), 15~28W
Intel® Celeron® 6305E, Dual Core, 4M Cache, 1.8GHz (1.8GHz), 15W
Memory
2 x 260-pin SO-DIMM up to 64GB (32GB per slot)
Dual channel DDR4 up to 3200MHz (Support in-band ECC)
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® Iris® Xe Graphics for i7/i5 Processors
Intel® UHD Graphics for i3/Celeron Processors
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display
1 x LVDS
1 x eDP
1 x DP++
1 x HDMI
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)

LVDS: resolution up to 1920x1200 @60Hz
eDP: resolution up to 3840x2160 @60Hz
DP: resolution up to 3840x2160 @60Hz
HDMI: resolution up to 3840x2160 @60Hz
USB Type C: resolution up to 3840x2160 @60Hz
Quad Displays
LVDS + eDP + DP++ + HDMI + USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
Expansion
Interface
1 x PCIe x4 (PCIe Gen 3 x4)
1 x M.2 2242/2280 M Key (PCIe Gen4 x4) (Support NVMe and Intel® Optane memory) (Support DFI proprietary expansion module)
1 x M.2 2242/3042/3052 B Key (PCIe Gen3 x1/SATA/USB 3.1 Gen1) (Support 4G/5G and storage module) (Opt.: PCIe Gen3 x2)
1 x M.2 2230 E Key (USB2.0) (Support Intel® CNVi module only and Intel® vPro)
1 x Nano-SIM Socket (Connect to M.2 Key B for 4G/5G module)

**Note: Intel CNVi module Support List: AX201 & AC-9560
Audio
Audio Codec
Realtek ALC888
Ethernet
Controller
2 x Intel® I211AT/I210IT PCIe (10/100/1000Mbps)
1 x Intel® I225LM/I225IT PCIe (10/100/1000Mbps/2.5Gbps)
Rear I/O
Ethernet
2 x GbE
1 x 2.5GbE
USB
4 x USB 3.1 Gen2 (Type-A)
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
Display
1 x DP++
1 x HDMI
Internal I/O
Serial
2 x RS-232/422/485 (2.0mm pitch)
2 x RS-232 (2.0mm pitch) (RS-232 w/ power)
USB
4 x USB 2.0 (2.0mm pitch)
Display
1 x LVDS
1 x eDP
Audio
1 x Front Audio (2.0mm pitch)
SATA
2 x SATA 3.0 (up to 6Gb/s) (RAID 0/1)
2 x SATA Power
DIO
1 x 8-bit DIO
1 x DIO Power
Other I/O
1 x CPU fan
1 x System fan
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
fTPM (default) / dTPM (option)
Power
Type
TGU171: Single 12V +/-5% DC (TGU171)
TGU173: Wide Range 9~36V (TGU173)
Connector
DC-in Jack
Right Angle Connector (4-pin) (available upon request)
Straightl Type Connector (4-pin) (available upon request)
Consumption
Idle: TGU173-IE-1185GRE 15W: 12V@ 1.12A (13.44W)
Max: TGU173-IE-1185GRE 15W: 12V@ 6.26A (75.12W)
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Linux
Environment
Temperature
Operating: -5 to 65°C / -20 to 70°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TGU171-IE-1185GRE 414,291 hrs @ 25°C; 254,601 hrs @ 45°C; 166,963 hrs @ 60°; 124,264 hrs @ 70°C;
TGU173-IE-1185GRE 397,863 hrs @ 25°C; 244,099 hrs @ 45°C; 160,483 hrs @ 60°; 119,765 hrs @ 70°C;
Calculation model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
Mini-ITX Form Factor
170mm (6.7") x 170mm (6.7")
Height
PCB: 1.6mm
Top Side: 16.5mm, Bottom Side: 3.5mm
Standards and Certifications
Certifications
CE, FCC, RoHS, UKCA
Packing List
Packing List
1 TGU171/TGU173 motherboard
1 COM port cable (Length: 250mm, 1 x COM ports) A81-015011-001G
1 Serial ATA data with power cable (Length: 300mm) A81-002013-000G
1 Heat sink
- (Wide/Normal Temp. -Cooler for 28W), A71-108158-000G (Default)
- (Normal Temp. Fanless HS for 15W), A71-008162-020G (By request)
- (Wide Temp. Fanless for 15W), A71-008162-030G (By request)
Country of Origin
Country of Origin
Taiwan
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    TGU171-IE-1185GRE
    Part Number :
    770-TGU1711-000G
    Description :
    Intel® Core™ i7-1185GRE, 2 SODIMM, 1 DP++, 1 HDMI, 3 LAN, 2 RS-232, 2 RS-232/422/485, 1 USB-C, 4 USB 3.1 Gen2, 4 USB 2.0, 12V DC, -20 to 70°C
  • Model Name :
    TGU171-IE-1145GRE
    Part Number :
    770-TGU1711-100G
    Description :
    Intel® Core™ i5-1145GRE, 2 SODIMM, 1 DP++, 1 HDMI, 3 LAN, 2 RS-232, 2 RS-232/422/485, 1 USB-C, 4 USB 3.1 Gen2, 4 USB 2.0, 12V DC, -20 to 70°C
  • Model Name :
    TGU171-IB-1115G4E
    Part Number :
    770-TGU1711-200G
    Description :
    Intel® Core™ i3-1115G4E, 2 SODIMM, 1 DP++, 1 HDMI, 3 LAN, 2 RS-232, 2 RS-232/422/485, 1 USB-C, 4 USB 3.1 Gen2, 4 USB 2.0, 12V DC, -5 to 65°C
  • Model Name :
    TGU171-IB-6305E
    Part Number :
    770-TGU1711-300G
    Description :
    Intel® Celeron 6305E, 2 SODIMM, 1 DP++, 1 HDMI, 3 LAN, 2 RS-232, 2 RS-232/422/485, 1 USB-C, 4 USB 3.1 Gen2, 4 USB 2.0, 12V DC, -5 to 65°C
  • Model Name :
    TGU173-IE-1185GRE
    Part Number :
    770-TGU1731-000G
    Description :
    Intel® Core™ i7-1185GRE, 2 SODIMM, 1 DP++, 1 HDMI, 3 LAN, 2 RS-232, 2 RS-232/422/485, 1 USB-C, 4 USB 3.1 Gen2, 4 USB 2.0, 9~36V DC, -20 to 70°C
  • Model Name :
    TGU173-IE-1145GRE
    Part Number :
    770-TGU1731-100G
    Description :
    Intel® Core™ i5-1145GRE, 2 SODIMM, 1 DP++, 1 HDMI, 3 LAN, 2 RS-232, 2 RS-232/422/485, 1 USB-C, 4 USB 3.1 Gen2, 4 USB 2.0, 9~36V DC, -20 to 70°C
  • Model Name :
    TGU173-IB-1115G4E
    Part Number :
    770-TGU1731-200G
    Description :
    Intel® Core™ i3-1115G4E, 2 SODIMM, 1 DP++, 1 HDMI, 3 LAN, 2 RS-232, 2 RS-232/422/485, 1 USB-C, 4 USB 3.1 Gen2, 4 USB 2.0, 9~36V DC, -5 to 65°C
  • Model Name :
    TGU173-IB-6305E
    Part Number :
    770-TGU1731-300G
    Description :
    Intel® Celeron 6305E, 2 SODIMM, 1 DP++, 1 HDMI, 3 LAN, 2 RS-232, 2 RS-232/422/485, 1 USB-C, 4 USB 3.1 Gen2, 4 USB 2.0, 9~36V DC, -5 to 65°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    COM port cable
    Part Number :
    A81-015011-001G
    Description :
    Length: 250mm, 1 x COM ports
  • Item Name :
    USB port cable
    Part Number :
    A81-001032-016G
    Description :
    Length: 200mm
  • Item Name :
    Serial ATA data cable
    Part Number :
    332-553001-005G
    Description :
    Length: 500mm
  • Item Name :
    Serial ATA power cable
    Part Number :
    A81-002044-016G
    Description :
    Length: 300mm

TGU Series accelerated by new Xe GPU

DFI's new-gen TGU Series embedded computing solutions are powered by 11th generation Intel® Core™ SoC processors designed for Edge AI vision computing. In the all-new Intel® Iris® Xe architecture, the high-performance, low-power SoC integrates with the GPU and CPU, and is combined with AI acceleration to make a big progress in the edge AI computing performance and handle complex computing applications, such as computer vision or high workloads, faster and more accurate.

Multiple Specs for Diverse Demands

The new industrial motherboards and embedded computer modules of TGU series are equipped with 11th Gen Intel® Core™ processors in a wide range of specifications from SBC, to Mini-ITX, to COM Express Compact, and to COM Express Mini. They meet the needs of industrial control, surveillance, traffic analysis, and vision computing at the edge.

All-new GPUs in Xe architecture

The Intel® Iris® Xe graphics integrated in the 11th Gen Intel® Core™ SoC have 96 compute units and 16MB of L3 cache, delivering disruptive GPU graphics performance. Paired with DDR4 memory on TGU series motherboards with increased bandwidth to 3200MHz and capacity to 64GB, it enables faster processing of images and video streams, and through minimal jitter drives real-time, efficient processing of multiple IoT tasks and workloads.

More Accurate AI Inference

The new TGU series has received a significant upgrade on the AI architecture. Besides the new support for Deep Learning Boost (DL Boost) and Vector Neural Network Instruction Set (VNNI), which were previously only available on Xeon processors, it also supports graphic card or Intel® Movidius™ VPUs AI accelerator card expansion for additional deep learning and inferencing capabilities.

Broadband, low-latency network transfer

The independent 2.5G LAN provides a faster transmission experience than a typical 1G LAN, and can be combined with the out-of-band (OOB) management system vPro and AMT to optimize and ensure the real-time and seamless collaboration of edge devices. The TGU series also supports broadband 5G, Wifi 6, and other wireless transmissions, giving more flexibility to device deployment beyond the limits of network cables.

Optimized Transfer and Interfaces

The new TGU series features the highest speed PCIe 4.0 transfer signal at present, offering a transmission speed up to 16 GT/s. It benefits the M.2 interface to enjoy the ultra-speedy transfer experience by connecting to either NVMe SSD or DFI proprietary M.2 expansion modules for USB 3.2 Gen1, SATA, COM, LAN, and PSE. The TGU series also offers a wide range of expansion interfaces, including PCIe x4, PCIe x1, M.2 M, B, E keys, SIM, and SATA, etc., supporting a variety of storage and network interfaces to provide more possibilities for edge computing innovation.

3-in-1 Transfer Design

All types of connectors in the near future will soon be united into a single interface – USB Type C. DFI TGU series motherboards offer the future-leading USB Type C interface, integrating three functions including display, data transfer and power supply via a USB hub at once, such as DisplayPort for 4K 60Hz display, LAN port for networking or surveillance, or NVMe SSD for data storage, and simultaneously powering up the USB hub or SSD. This 3-in-1 transfer design makes it easier to integrate the system with the interface of the latest devices to connect to the future.

4 X 4K HDR with high contrast resolution

The TGU Series offers up to four channels of 4K high dynamic range (HDR) independent displays, providing more details of light and dark, images closer to reality, and even realizing ultra-smooth video streams. The high contrast resolution allows every small detail on x-rays and tomograms to be clearly displayed, delivering a more accurate diagnostic assistance to healthcare professionals.

Enhanced IoT Network Security

The TGU Series protects devices from cold boot attacks with the new Total Memory Encryption (TME) feature, and ensures that devices are fully protected against possible external attacks at booting, data storing, or data processing.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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