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Home System-On-Modules COM Express Compact TGU968
  • 11th Generation Intel® Processor COM Express® Compact
  • DDR4 3200MHz SODIMM up to 64GB
  • DP++ supports 4K x 2K resolution
  • Multiple expansion: 8 PCIe x1, 1 I2C, 1 SMBus
  • Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q3' 35 (Based on Intel IOTG Roadmap)

Status : Launched QUOTE NOW

Wide-temp: -40°C~85°C
4K2K Display
Product Comparison
You have items. ,Up to 3 items.
You have ,Up to 3 items.
RoHS Certification
CE Certification
FCC Certification
UKCA Certification

TGU968 Related Tags

#Slim Bootloader#IoT#Intel#4K2K Display#Windows#Linux#HDMI#VGA#DDR4#RoHS Certification#CE Certification#FCC Certification#11th Gen Intel® Tiger Lake Processor#UKCA Certification
Intel® Core™ i7-1185G7E Processor (Core 4; Max speed 2.8 GHz; TDP 15-28W)
Intel® Core™ i7-1185GRE Processor (Core 4; Max speed 2.8 GHz; TDP 15-28W)
Intel® Core™ i5-1145G7E Processor (Core 4; Max speed 2.6 GHz; TDP 15-28W)
Intel® Core™i5-1145GRE Processor (Core 4; Max speed 2.6 GHz; TDP 15-28W)
Intel® Core™ i3-1115G4E Processor (Core 2; Max speed 3.0 GHz; TDP 15-28W)
Intel® Core™ i3-1115GRE Processor (Core 2; Max speed 3.0 GHz; TDP 15-28W)
Intel® Celeron® 6305E Processor (Core 2; Max speed 1.8 GHz; TDP 15W)
Two 260-pin SODIMM up to 64GB
Dual Channel DDR4 3200MHz
Intel® Iris® Xe graphics
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
3 x DDI
VGA: resolution up to 1920x1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
eDP: resolution up to 4096x2304 @ 60Hz
HDMI: resolution up to 4096x2160 @ 30Hz
DP++: resolution up to 4096x2304 @ 60Hz
VGA + LVDS + DDI DDI + eDP + DDI (available upon request)
1 x PCIe x4 (Gen 4)
5 x PCIex1 (Gen3) (8 x PCIex1 available upon request)
1 x I2C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
HD Audio
1 x Intel® I225 series (10/100/1000Mbps/2.5G)
4 x USB 3.1 Gen.2
8 x USB 2.0
2 x SATA 3.0 (up to 6Gb/s)
1 x 64GB/128GB/256GB/512GB/1024GB on board SSD (available upon request)
1 x 8-bit DIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Available Upon Request
8.5~20V, 5VSB, VCC_RTC (ATX mode)
8.5~20V, VCC_RTC (AT mode)
OS Support
OS Support
(UEFI Only)
Windows: Windows 10 IoT Enterprise 64-bit
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Operating: 10 to 90% RH
Storage: 10 to 90% RH
COM Express® Compact 95mm (3.74") x 95mm (3.74")
PICMG COM Express® R3.0, Type 6
Standards and Certifications
Packing List
Packing List
Country of Origin
Country of Origin
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    Part Number :
    Description :
    I7-1185GRE, 2 SODIMM, LVDS, LAN, SATA, 4 USB3.2 Gen2, 8 USB2.0, NVMe 64GB, ATX/AT, Cooler, -40 to 85°C
  • Model Name :
    Part Number :
    Description :
    I5-1145G7E, 2 SODIMM, LVDS, LAN, SATA, 4 USB3.2 Gen2, 8 USB2.0, ATX/AT, Heatsink, 0 to 60°C
  • Model Name :
    Part Number :
    Description :
    I3-1115GRE, 2 SODIMM, LVDS, LAN, SATA, 4 USB3.2 Gen2, 8 USB2.0, ATX/AT, Cooler, -40 to 85°C
  • Model Name :
    Part Number :
    Description :
    Celeron 6305E, 2 SODIMM, eDP, LAN, SATA, 4 USB3.2 Gen2, 8 USB2.0, ATX/AT, Heatsink, 0 to 60°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    Heat Spreader
    Part Number :
    Description :
  • Item Name :
    COM335 Carrier Board Kit
    Part Number :
    Description :

TGU Series accelerated by new Xe GPU

DFI's new-gen TGU Series embedded computing solutions are powered by 11th generation Intel® Core™ SoC processors designed for Edge AI vision computing. In the all-new Intel® Iris® Xe architecture, the high-performance, low-power SoC integrates with the GPU and CPU, and is combined with AI acceleration to make a big progress in the edge AI computing performance and handle complex computing applications, such as computer vision or high workloads, faster and more accurate.

Multiple Specs for Diverse Demands

The new industrial motherboards and embedded computer modules of TGU series are equipped with 11th Gen Intel® Core™ processors in a wide range of specifications from SBC, to Mini-ITX, to COM Express Compact, and to COM Express Mini. They meet the needs of industrial control, surveillance, traffic analysis, and vision computing at the edge.

All-new GPUs in Xe architecture

The Intel® Iris® Xe graphics integrated in the 11th Gen Intel® Core™ SoC have 96 compute units and 16MB of L3 cache, delivering disruptive GPU graphics performance. Paired with DDR4 memory on TGU series motherboards with increased bandwidth to 3200MHz and capacity to 64GB, it enables faster processing of images and video streams, and through minimal jitter drives real-time, efficient processing of multiple IoT tasks and workloads.

More Accurate AI Inference

The new TGU series has received a significant upgrade on the AI architecture. Besides the new support for Deep Learning Boost (DL Boost) and Vector Neural Network Instruction Set (VNNI), which were previously only available on Xeon processors, it also supports graphic card or Intel® Movidius™ VPUs AI accelerator card expansion for additional deep learning and inferencing capabilities.

Broadband, low-latency network transfer

The independent 2.5G LAN provides a faster transmission experience than a typical 1G LAN, and can be combined with the out-of-band (OOB) management system vPro and AMT to optimize and ensure the real-time and seamless collaboration of edge devices. The TGU series also supports broadband 5G, Wifi 6, and other wireless transmissions, giving more flexibility to device deployment beyond the limits of network cables.

Optimized Transfer and Interfaces

The new TGU series features the highest speed PCIe 4.0 transfer signal at present, offering a transmission speed up to 16 GT/s. It benefits the M.2 interface to enjoy the ultra-speedy transfer experience by connecting to either NVMe SSD or DFI proprietary M.2 expansion modules for USB 3.2 Gen1, SATA, COM, LAN, and PSE. The TGU series also offers a wide range of expansion interfaces, including PCIe x4, PCIe x1, M.2 M, B, E keys, SIM, and SATA, etc., supporting a variety of storage and network interfaces to provide more possibilities for edge computing innovation.

3-in-1 Transfer Design

All types of connectors in the near future will soon be united into a single interface – USB Type C. DFI TGU series motherboards offer the future-leading USB Type C interface, integrating three functions including display, data transfer and power supply via a USB hub at once, such as DisplayPort for 4K 60Hz display, LAN port for networking or surveillance, or NVMe SSD for data storage, and simultaneously powering up the USB hub or SSD. This 3-in-1 transfer design makes it easier to integrate the system with the interface of the latest devices to connect to the future.

4 X 4K HDR with high contrast resolution

The TGU Series offers up to four channels of 4K high dynamic range (HDR) independent displays, providing more details of light and dark, images closer to reality, and even realizing ultra-smooth video streams. The high contrast resolution allows every small detail on x-rays and tomograms to be clearly displayed, delivering a more accurate diagnostic assistance to healthcare professionals.

Enhanced IoT Network Security

The TGU Series protects devices from cold boot attacks with the new Total Memory Encryption (TME) feature, and ensures that devices are fully protected against possible external attacks at booting, data storing, or data processing.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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