We have noticed that you are visiting from North American areas. Would you like to browse the US site (US.DFI.com) for a better experience?

Would you answer a brief survey?

Thank you for taking this survey. Your feedback will help us improve our official website and provide a better user experience.

Your feedback has been successfully submitted. Thank you very much for your time and participation.

Close

TGU9A2|Intel®|System-On-Modules|DFI

TGU9A2
Home System-On-Modules COM Express Mini TGU9A2
  • 11th Generation Intel® Processor COM Express® Mini
  • Single Channel LPDDR4X 4266MHz;Memory Down up to 16GB
  • 1 eDP, 1 DDI (HDMI/DVI/DP++) , Dual Display:DDI + eDP
  • DP++ supports 4K x 2K resolution
  • Multiple expansion: 1 PCIe x4, 2 I2C, 1 SMBus
  • Rich I/O: 1 Intel GbE, 2 USB 3.2, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q2' 35 (Based on Intel IOTG Roadmap)

Status : Launched QUOTE NOW

4K2K Display
DDR4
Product Comparison
You have items. ,Up to 3 items.
COMPARE NOW
Quotation
You have ,Up to 3 items.
QUOTE NOW
RoHS Certification
CE Certification
FCC Certification
UKCA Certification

TGU9A2 Related Tags

#IoT#Intel#4K2K Display#Windows#Linux#HDMI#DP#DDR4#RoHS Certification#CE Certification#FCC Certification#11th Gen Intel® Tiger Lake Processor#UKCA Certification
TGU9A2
TGU9A2
System
Processor
Intel® Core™ i7-1185G7E Processor (Core 4; Max speed 2.8 GHz; TDP 15-28W)
Intel® Core™ i7-1185GRE Processor (Core 4; Max speed 2.8 GHz; TDP 15-28W)
Intel® Core™ i5-1145G7E Processor (Core 4; Max speed 2.6 GHz; TDP 15-28W)
Intel® Core™ i5-1145GRE Processor (Core 4; Max speed 2.6 GHz; TDP 15-28W)
Intel® Core™ i3-1115G4E Processor (Core 2; Max speed 3.0 GHz; TDP 15-28W)
Intel® Core™ i3-1115GRE Processor (Core 2; Max speed 3.0 GHz; TDP 15-28W)
Intel® Celeron® 6305RE Processor (Core 2; Max speed 1.8 GHz; TDP 15W)
Memory
Memory Down up to 16GB
Single Channel LPDDR4X 4266MHz
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® Iris® Xe graphics
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display
1 x DDI (HDMI/DVI/DP++)
1 x eDP

HDMI: resolution up to 3840x2160 @ 30 Hz
DP++: resolution up to 4096x2160 @ 60Hz
eDP: resolution up to 3840x2160 @ 60Hz
Dual Displays
DDI + eDP
Expansion
Interface
1 x PCIe x4 (Gen 3)
1 x I2C
1 x SMBus
2 x SPI
2 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® Ethernet I225IT (10M/100M/1000M/2.5Gbps)
I/O
USB
2 x USB 3.2 Gen.2
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
SSD
1 x 64GB/128GB/256GB/512GB/1024GB on board SSD (available upon request)
DIO
1 x 8-bit DIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
FTPM
BIOS default support FTPM, TPM2.0 by request
Power
Type
4.75V~20V, 5VSB, VCC_RTC (ATX mode)
4.75V~20V, VCC_RTC (AT mode)
OS Support
OS Support
Windows: Windows 10 IoT Enterprise 64-bit
Linux
Environment
Temperature
Operating: -5 to 65°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 10 to 90% RH
Storage: 10 to 90% RH
MTBF
1,230,760 hrs @ 25°C ; 845,813 hrs @ 45°C ; 598,810 hrs @ 60°C
464,366 hrs @ 70°C ; 309,043 hrs @ 85°C
Calculation Model : Telcordia Issue 4
Environment : GB, GC - Ground Benign, Controlled
Mechanism
Dimensions
COM Express® Mini 84mm (3.3") x 55mm (2.16")
Compliance
PICMG COM Express® R3.0, Type 10
Standards and Certifications
Certifications
CE, FCC, RoHS, UKCA
Packing List
Packing List
• CPU Cooler (i7 & i5 Series) A71-108139-000G
• CPU Cooler (i3 & Celeron Series) A71-108139-010G
Country of Origin
Country of Origin
Taiwan
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    TGU9A2-T16-1185GRE
    Part Number :
    770-TGU9A21-000G
    Description :
    I7 1185GRE, 16 GB, eDP, DIO, TPM 2.0, SSD 64 GB, Operating temp. -40-85°C
  • Model Name :
    TGU9A2-T86-1185GRE
    Part Number :
    770-TGU9A21-100G
    Description :
    I7 1185GRE, 8 GB, eDP, DIO, TPM 2.0, SSD 64 GB, Operating temp. -40-85°C
  • Model Name :
    TGU9A2-T16-1145GRE
    Part Number :
    770-TGU9A21-200G
    Description :
    I5 1145GRE, 16 GB, eDP, DIO, TPM 2.0, SSD 64 GB, Operating temp. -40-85°C
  • Model Name :
    TGU9A2-B86-1115G4E
    Part Number :
    770-TGU9A21-300G
    Description :
    I3 1115G4E, 8 GB, eDP, DIO, TPM 2.0, SSD 64 GB, Operating temp. -5-65°C
  • Model Name :
    TGU9A2-B86-6305E
    Part Number :
    770-TGU9A21-400G
    Description :
    Celeron 6305E, 8 GB, eDP, DIO, TPM 2.0, SSD 64 GB, Operating temp. -5-65°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    Heat Spreader
    Part Number :
    A71-808338-000G
    Description :
  • Item Name :
    COM100-B Carrier Board Kit
    Part Number :
    770-COM104-000G
    Description :
  • Item Name :
    COM335 Carrier Board Kit
    Part Number :
    770-CM3351-000G
    Description :

TGU Series accelerated by new Xe GPU

DFI's new-gen TGU Series embedded computing solutions are powered by 11th generation Intel® Core™ SoC processors designed for Edge AI vision computing. In the all-new Intel® Iris® Xe architecture, the high-performance, low-power SoC integrates with the GPU and CPU, and is combined with AI acceleration to make a big progress in the edge AI computing performance and handle complex computing applications, such as computer vision or high workloads, faster and more accurate.

Multiple Specs for Diverse Demands

The new industrial motherboards and embedded computer modules of TGU series are equipped with 11th Gen Intel® Core™ processors in a wide range of specifications from SBC, to Mini-ITX, to COM Express Compact, and to COM Express Mini. They meet the needs of industrial control, surveillance, traffic analysis, and vision computing at the edge.

All-new GPUs in Xe architecture

The Intel® Iris® Xe graphics integrated in the 11th Gen Intel® Core™ SoC have 96 compute units and 16MB of L3 cache, delivering disruptive GPU graphics performance. Paired with DDR4 memory on TGU series motherboards with increased bandwidth to 3200MHz and capacity to 64GB, it enables faster processing of images and video streams, and through minimal jitter drives real-time, efficient processing of multiple IoT tasks and workloads.

More Accurate AI Inference

The new TGU series has received a significant upgrade on the AI architecture. Besides the new support for Deep Learning Boost (DL Boost) and Vector Neural Network Instruction Set (VNNI), which were previously only available on Xeon processors, it also supports graphic card or Intel® Movidius™ VPUs AI accelerator card expansion for additional deep learning and inferencing capabilities.

Broadband, low-latency network transfer

The independent 2.5G LAN provides a faster transmission experience than a typical 1G LAN, and can be combined with the out-of-band (OOB) management system vPro and AMT to optimize and ensure the real-time and seamless collaboration of edge devices. The TGU series also supports broadband 5G, Wifi 6, and other wireless transmissions, giving more flexibility to device deployment beyond the limits of network cables.

Optimized Transfer and Interfaces

The new TGU series features the highest speed PCIe 4.0 transfer signal at present, offering a transmission speed up to 16 GT/s. It benefits the M.2 interface to enjoy the ultra-speedy transfer experience by connecting to either NVMe SSD or DFI proprietary M.2 expansion modules for USB 3.2 Gen1, SATA, COM, LAN, and PSE. The TGU series also offers a wide range of expansion interfaces, including PCIe x4, PCIe x1, M.2 M, B, E keys, SIM, and SATA, etc., supporting a variety of storage and network interfaces to provide more possibilities for edge computing innovation.

3-in-1 Transfer Design

All types of connectors in the near future will soon be united into a single interface – USB Type C. DFI TGU series motherboards offer the future-leading USB Type C interface, integrating three functions including display, data transfer and power supply via a USB hub at once, such as DisplayPort for 4K 60Hz display, LAN port for networking or surveillance, or NVMe SSD for data storage, and simultaneously powering up the USB hub or SSD. This 3-in-1 transfer design makes it easier to integrate the system with the interface of the latest devices to connect to the future.

4 X 4K HDR with high contrast resolution

The TGU Series offers up to four channels of 4K high dynamic range (HDR) independent displays, providing more details of light and dark, images closer to reality, and even realizing ultra-smooth video streams. The high contrast resolution allows every small detail on x-rays and tomograms to be clearly displayed, delivering a more accurate diagnostic assistance to healthcare professionals.

Enhanced IoT Network Security

The TGU Series protects devices from cold boot attacks with the new Total Memory Encryption (TME) feature, and ensures that devices are fully protected against possible external attacks at booting, data storing, or data processing.

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

Get Started