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M8MP553 | NXP® | i.MX 8M Plus Series | 3.5" SBC | DFI

M8MP553
Industrial Motherboards 3.5" SBC M8MP553
  • NXP i.MX8M plus Processors: 30% performance enhancement
  • Wide Voltage Support 9~36VDC
  • 2 GbE LAN for automation application
  • CAN bus for automation equipments integration
  • M.2 2230/3052: 1 M.2 B key for PCIe & SATA expansion
  • 15-Year CPU Life Cycle Support Until Q1' 36 (Based on NXP Roadmap)

Status : Sample Available

Wide Voltage: 9~36V DC-in
Fanless Design
4K2K Display
Android
Multiple Expansion
DDR4
Wide-temp: -30~85°C
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RoHS Certification
CE Certification
FCC Certification

M8MP553 Related Tags

#IoT#5G#ARM#Fanless Design#Compact Size#4K2K Display#Linux#Android#HDMI#Multiple Expansion#DDR4#Low Power Consumption
M8MP553
M8MP553
M8MP553
M8MP553
System
Processor
i.MX 8M plus applications processors
Quad, Dual Cortex-A53 CPU
Memory
2GB/4GB LPDDR4 Memory Down
Graphics
Controller
GC7000UL
Feature
HW Decode: 1080p60 H.265,H.264, VP9, VP8
HW Endcode: 1080p60 H.265,H.264
Display
1 x HDMI, resolution up to 1920x1080 @60Hz
1 x LVDS, resolution up to 1920x1200 @60Hz
Dual Displays
LVDS + HDMI
Andriod:support single output
Storage
eMMC
1 x eMMC 5.1 with default 16GB (up to 64GB)
Expansion
Interface
1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0/PCIe x1)
1 x M.2 E key 2230 (PCIe x1/USB 2.0)
1 x Nano SIM slot (opt.)
Audio
Audio Codec
Audio codec SGTL5000
Ethernet
PHY
AR8035
Rear I/O
Ethernet
2 x GbE (RJ-45)
Serial
1 x RS485 (2-wire)
USB
2 x USB 3.1 Gen1
2 x USB 2.0
Display
1 x HDMI
Internal I/O
Serial
1 x RS232
1 x RS232/422/485 (2.0mm pitch)
USB
2 x USB 2.0 (2.00mm pitch, the 2nd USB is opt. from M.2 3052)
1 x Micro USB OTG
Display
1 x LVDS LCD Panel connector
1 x LCD/Intverter Power
Audio
1 x Audio (Line-out/Mic-in)
DIO
1 x 8-bit DIO
SD
1 x uSD card
CANBus
2 x CAN bus 2.0b on Industrial CPU sku
I2C
1 x I2C
1 x PWM
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Power
Type
Wide Range 9~36VDC
Connector
2-pole terminal block (default)
Co-lay 4-pin vertical power connector
Consumption
TBD
Battery
CR2032 Coin Cell
OS Support
Linux
Linux Yocto 3.0 (default)
Software
Android 10
Environment
Temperature
Operating: -5 to 65°C, -30 to 80 °C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
3.5" SBC Form Factor
146mm (5.75") x 102mm (4.02")
Height
PCB: TBD
Top Side: TBD
Bottom Side: TBD
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
1 M8MP553 board
1 Terminal block for RS485 (COM3) 342-361021-000G
1 Heatsink (Height: 21mm) A71-008168-000G
Country of Origin
Country of Origin
Taiwan
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    M8MP553-BCC-41QDC
    Part Number :
    770-8MP5531-000G
    Description :
    Quad Core Processor, 4 GB Memory Down, eMMC 16 GB, 2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0, Power 9~36VDC, fanless design, -5 to 65°C
  • Model Name :
    M8MP553-BCC-21DLC
    Part Number :
    770-8MP5531-100G
    Description :
    Dual Core Processor, 2 GB Memory Down, eMMC 16 GB, 2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0, Power 9~36VDC, fanless design, -5 to 65°C

*

Optional Items
  • Item Name Part Number Description
  • Item Name :
    2 pole terminal to DC jack cable
    Part Number :
    A81-004013-000G
    Description :
  • Item Name :
    Power adapter
    Part Number :
    671-106012-000G
    Description :
    60W, 12V, DC Jack
  • Item Name :
    USB 2.0 cable
    Part Number :
    A81-001032-016G
    Description :
    Length: 200mm
  • Item Name :
    COM port cable
    Part Number :
    TBD
    Description :
    Length: TBD, COM1/4
  • Item Name :
    Audio
    Part Number :
    A81-022031-016G
    Description :
    Length: 300mm
  • Item Name :
    Heat spreader
    Part Number :
    TBD
    Description :
    Height: 11mm

Working with DFI

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