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ICD970|Intel®|System-On-Modules|DFI

ICD970
Home System-On-Modules COM Express Basic ICD970
  • 3rd Gen Intel® Xeon® Processor D-1700 Family
  • Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB, 3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz)
  • Support extended operating temperature: -40 to 85°C
  • 10GBASE-KR: Support up to 4 x 10GbE Mac ports
  • Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX)
  • Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0
  • 15-Year CPU Life Cycle Support Until Q1' 37 (Based on Intel IOTG Roadmap)

Status : Launched QUOTE NOW

Wide-temp: -40°C~85°C
PCIe x16
ECC Memory
Multiple Expansion
10G Ethernet
DDR4
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RoHS Certification
CE Certification
FCC Certification

ICD970 Related Tags

#Slim Bootloader#IoT#Intel#5G#Fanless Design#PCIe x16#Windows#Linux#Multiple Expansion#10G Ethernet#DDR4#RoHS Certification#CE Certification#FCC Certification#High-Performance#Medical#Intel® 3rd Gen Xeon Ice Lake-SP Processor
ICD970
ICD970
System
Processor
3rd Gen Intel® Xeon® Scalable Processors D-1700 Family
Intel® Xeon® D-1746TER Processor, 10 Cores, 15MB Cache, 2.0GHz, 67W
Intel® Xeon® D-1735TR Processor, 8 Cores, 15MB Cache, 2.2GHz, 59W
Intel® Xeon® D-1732TE Processor, 8 Cores, 15MB Cache, 1.9GHz, 52W
Intel® Xeon® D-1715TER Processor, 4 Cores, 10MB Cache, 2.4GHz, 50W
Intel® Xeon® D-1712TR Processor, 4 Cores, 10MB Cache, 2.0GHz, 40W
Memory
Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB
3rd DIMM by request
(SDPC mode by request to support DDR4 2933MHz)
BIOS
Insyde SPI 512Mbit
Expansion
Interface
Default:
B1: 1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3)
B2: 1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3)
B3/B4: 1 x PCIe x16 or 2 x PCIe x8 or 4x PCIe x4 (Gen 4)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
Ethernet
Controller
Supports up to 4 x 10GBASE-KR interfaces and max up to 4 x 10GbE MAC ports (maximum bandwidth 40Gb by activating the 4 x 10GbE at the same time)
1 x Intel® I210AT (10/100/1000Mbps) (0 to 60°C) or
1 x Intel® I210IT (10/100/1000Mbps) (-40 to 85°C)
I/O
USB
4 x USB 3.0
4 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO (4 in, 4 out)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
Default TPM2.0, fTPM by request
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption
Typical: 71.36W
Max: 72.36W
OS Support
Microsoft
Windows Server 2019, 2022
Linux
Ubuntu 20.04, CentOS 7.5
Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
277,731hrs @25°C; 144,676hrs @45°C; 81,589hrs @60°C; 55,811hrs @70°C; 37,526 @85°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
COM Express® Basic
95mm (3.74") x 125mm (4.9")
Compliance
PICMG COM Express® R3.0, Type 7
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
1 ICD970 board
1 Cooler (Height: 47.80 mm) 0 to 60°C: TBD / -40 to 85°C: TBD
Country of Origin
Country of Origin
Taiwan
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    ICD970-TS-1746
    Part Number :
    770-ICD9701-000G
    Description :
    Intel® Xeon® D-1746TER (67W), eMMC 16GB, TPM 2.0, Termal: Cooler, Operating temp.: -40~85°C
  • Model Name :
    ICD970-BS-1712
    Part Number :
    770-ICD9701-100G
    Description :
    Intel® Xeon® D-1712TR (40W), eMMC 16GB, TPM 2.0, Termal: Cooler, Operating temp.: 0~60°C
  • Model Name :
    ICD970-TS-1715
    Part Number :
    770-ICD9701-200G
    Description :
    Intel® Xeon® D-1715TER (50W), eMMC 16GB, TPM 2.0, Thermal: Cooler, Operating temp.: -40~85°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    COM336 carrier board kit
    Part Number :
    770-COM3361-000G
    Description :
  • Item Name :
    Heat spreader
    Part Number :
    A71-808352-000G
    Description :

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