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High Performance AMD Ryzen™ R2000 Processor-PCSF51

High Performance AMD Ryzen™ R2000 Processor-PCSF51

Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

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Creates New Smart Fleet Management Applications

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X6-MTH｜Intel®｜Industrial Computers｜DFI

X6-MTH
Overview
Overview
Specification
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Home Industrial Computers AI Inference/Training System X6-MTH
  • Intel® Core™ Ultra 5/7 Processor (Meteor Lake: U/H-series)
  • Dual Channel DDR5 5600MHz SODIMM up to 64GB
  • Supports 2 GbE, 2 USB 3.2, 2 USB 2.0, 1 RS232/422/485/ CAN bus/ GPIO port
  • Multiple Expansions: 3 B, M, E key M.2 slots
  • Support DFI defined Out of band management
  • Up to 32 TOPS of AI performance

Status : Preliminary QUOTE NOW

Wide Voltage: 9~36V DC-in
4K2K Display
Multiple Expansion
DDR5
AI
Out-of-band (OOB)
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RoHS Certification
CE Certification
FCC Certification
UL-US Certification

X6-MTH Related Tags

#DDR5#Windows 10#9~36V DC-in#Edge AI Computing#M.2#Out-Of-Band (OOB)#Intel® Core™ Ultra processors #AI#Windows 11#Intel#SIM Slot#CAN-Bus#Compact Size#4K2K Display#1G Ethernet#Windows#Linux#HDMI#VGA#Multiple Expansion#RoHS Certification#UL Certification#CE Certification#FCC Certification#UL-US Certification

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System
Processor
Intel® Core™ Ultra 7 165U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 7 155U (2 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 5 155U (2 P-Cores x 1.6 GHz, 8 E-Cores x 1.1 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 5 135U (2 P-Cores x 1.3 GHz, 8 E-Cores x 0.8 GHz, 12 MB cache, 15W)
Intel® Core™ Ultra 7 165H (6 P-Cores x 1.4 GHz, 8 E-Cores x 0.9 GHz, 24 MB cache, 28W)
Intel® Core™ Ultra 7 155H (6 P-Cores x 1.4 GHz, 8 E-Cores x 0.9 GHz, 24 MB cache, 28W)
Intel® Core™ Ultra 5 135H (4 P-Cores x 1.7 GHz, 8 E-Cores x 1.2 GHz, 18 MB cache, 28W)
Intel® Core™ Ultra 5 125H (4 P-Cores x 1.2 GHz, 8 E-Cores x 0.7 GHz, 18 MB cache, 28W)
Memory
Two 260-Pin SO-DIMM up to 64GB
Dual Channel DDR5 5600MHz
BIOS
AMI SPI
Graphics
Controller
Intel® Iris® Xe Graphics
Feature
DX12, Open GL 4.6, Vulkan 1.2
HW Decode: HEVC/VP9/AV1/AVC/H.265/MJPEG
HW Encode: HEVC/VP9/AV1/AVC/H.265/MJPEG
Display
1 x VGA
1 x HDMI
Storage
Interface
1 x 64GB/128GB/256GB/512GB/1024GB on board SSD
M.2 2280 M key (SATA 3 and PCIe gen3 x4 for NVMe)
Optional 1x 2.5” SATA tray kit
Expansion
Interface
1 x M.2 3042/3052 B key (PCIex2, USB 2.0) and 1 x Nano SIM slot
1 x M.2 2230 E key (PCIe x1, USB 2.0)
2 x M.2 2242/2280 M key (PCIe gen3 x1 for NVMe)
1 x M.2 A key for DFI OOB
Ethernet
Controller
1 RJ45 GbE from I226LM
1 RJ45 GbE from Intel i210AT
LED
Indicators
1 x Power Status
1 x HDD activity
Front I/O
Ethernet
2 x RJ45 GbE
Serial
1 combo DB-9 RS232/422/485/ CAN bus/ GPIO port
USB
2 x USB 3.2
2 x USB 2.0
Display
1 x VGA
1 x HDMI
DC in
1 x 4-pin power terminal block
Flank I/O
Antenna Hole
4 x antenna holes
Internal I/O
OOB
Support DFI OOB module
Security
TPM
TPM 2.0
Power
Type
9-36V DC
Connector
1 x 4-pin terminal block
RTC Battery
CR2032
OS Support
Microsoft
Windows 10, 11
Linux
Ubuntu 22.04
Environment
Operating Temperature
-20°C to 60°C (sku dependent)
Storage Temperature
-40°C to 85°C
Relative Humidity
5 to 95% RH (non-condensing)
Mechanism
Construction
Aluminum + SGCC
Mounting
Wall mount (mounting brackets and screws)
DIN mount by optional
Dimensions (W x H x D)
165 x 65 x 150 mm
Weight
< 2 kg
Standards and Certifications
Shock
· Operation
IEC 60068-2-27 Test Ea: Shock test
Half-sine, 3G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times)
· Non- Operation
IEC 60068-2-27 Test Ea: Shock test
Half-sine, 5G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times)
Vibration
· Operation
IEC 60068-2-64 Test Fh: Vibration board-band random test
Random,2Grms @ 5~500 Hz, 30min.
· Non- Operation
IEC 60068-2-6 Test Fc: Vibration Sinusoidal Test
Sweep sine, 3Grms @ 10~500Hz, 30min.
Certifications
CE, FCC Class A, RoHS, UL 62368-1
Country of Origin
Country of Origin
Taiwan
Product Collaterals

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