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High Performance AMD Ryzen™ R2000 Processor-PCSF51

High Performance AMD Ryzen™ R2000 Processor-PCSF51

Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

Creates New Smart Fleet Management Applications

Creates New Smart Fleet Management Applications

VC900-M8M installed VicOne's vehicle network security solution, xCarbon, develope a smart city and construct an efficient and safe intelligent transportation system (ITS).

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IS-5222｜Intel®｜Industrial Motherboards｜DFI

IS-5222
Overview
Overview
Specification
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Home Industrial Motherboards EATX IS-5222
  • 3rd Gen Intel® Xeon® Scalable Processor Family
  • 16 DDR4 ECC-RDIMM up to 1024GB
  • Single Display: VGA
  • IPMI OOB Remote Management
  • Multiple Expansion: 3 PCIe x16 Gen4, 2 PCIe x8 Gen4, 1 M.2 M Key
  • Rich I/O: 2 10GbE, 2 SATA 3.0, 4 USB 3.1 Gen1, 4 USB 2.0, 2 COM, 1 Dedicated IPMI

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VGA
Multiple Expansion
DDR4
Rich I/O
Out-of-band (OOB)
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CE Certification
FCC Certification

IS-5222 Related Tags

#Windows 10#M.2#3rd Gen Intel Xeon Scalable Family#OOB#Out-Of-Band (OOB)#Server Boards#IoT#Intel#PCIe x16#Windows#VGA#Multiple Expansion#10G Ethernet#DDR4#CE Certification#FCC Certification
IS-5222｜Intel®｜Industrial Motherboards｜DFI
IS-5222｜Intel®｜Industrial Motherboards｜DFI

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System
Processor
3rd Gen Intel® Xeon® Scalable Processor Family, LGA 4189 (Socket P+)
Intel® Xeon® Gold 6338N ( 32 Cores, 48 MB Cache, up to 3.50 GHz )
Intel® Xeon® Gold 6338T ( 24 Cores, 36 MB Cache, up to 3.40 GHz )
Intel® Xeon® Gold 6336Y ( 24 Cores, 36 MB Cache, up to 3.60 GHz )
Intel® Xeon® Gold 6330 ( 28 Cores, 42 MB Cache, up to 3.10 GHz )
Intel® Xeon® Gold 6330N ( 28 Cores, 42 MB Cache, up to 3.40 GHz )
Intel® Xeon® Gold 6326 ( 16 Cores, 24 MB Cache, up to 3.50 GHz )
Intel® Xeon® Gold 6314U ( 32 Cores, 48 MB Cache, up to 3.40 GHz )
Intel® Xeon® Gold 6312U ( 24 Cores, 36 MB Cache, up to 3.60 GHz )
Intel® Xeon® Gold 5320T ( 20 Cores, 30 MB Cache, up to 3.50 GHz )
Intel® Xeon® Gold 5318N ( 24 Cores, 36 MB Cache, up to 3.40 GHz )
Intel® Xeon® Gold 5318Y ( 24 Cores, 36 MB Cache, up to 3.40 GHz )
Intel® Xeon® Gold 5317 ( 12 Cores, 18 MB Cache, up to 3.60 GHz )
Intel® Xeon® Gold 5315Y ( 8 Cores, 12 MB Cache, up to 3.60 GHz )
Intel® Xeon® Silver 4316 ( 20 Cores, 30 MB Cache, up to 3.40 GHz )
Intel® Xeon® Silver 4314 ( 16 Cores, 24 MB Cache, up to 3.40 GHz )
Intel® Xeon® Silver 4310 ( 12 Cores, 18 MB Cache, up to 3.30 GHz )
Intel® Xeon® Silver 4310T ( 10 Cores, 15 MB Cache, up to 3.40 GHz )
Chipset
Intel® C621A Chipset
Memory
16 x 288-pin ECC-RDIMM up to 1024GB
Single Channel DDR4 up to 3200 MHZ
BIOS
AMI 64Mb SPI BIOS
Graphics
Controller
BMC AST2500
Display
1 x VGA
VGA: resolution up to 1920x1200 @ 60Hz
Single Display
VGA
Expansion
Interface
1 x M.2 2280 M key (PCIe Gen3 x1 NVMe)
3 x PCIe x16 Gen4 slot
2 x PCIe x8 Gen4 slot
Rear I/O
Ethernet
2 x 10GbE (RJ-45)
1 x Dedicated IPMI LAN
USB
2 x USB 3.1 Gen1 (USB 3.1 stack)
Display
1 x VGA (DB-15)
Internal I/O
Serial
2 x RS-232 (2x5-pin)
USB
2 x USB 3.1 Gen1
4 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
RAID 0/1
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Power
Type
ATX
Connector
8-pin ATX 12V CPU power
24-pin ATX power
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows 10 IoT Enterprise LTSB RS5(64-bit)
Environment
Temperature
Operating: 0 to 40°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH, Non-condensing
Storage: 5 to 90% RH, Non-condensing
MTBF
TBD
Mechanism
Dimensions
EATX Form Factor
305mm (12") x 330mm (13")
Height
PCB: 1.6mm
Standards and Certifications
Certifications
CE, FCC
Country of Origin
Country of Origin
Taiwan
Product Collaterals

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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