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High Performance AMD Ryzen™ R2000 Processor-PCSF51

High Performance AMD Ryzen™ R2000 Processor-PCSF51

Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

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Creates New Smart Fleet Management Applications

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F8000｜NXP｜System-On-Modules｜DFI

F8000
Overview
Overview
Specification
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Ordering Information
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Home System-On-Modules SMARC F8000
  • NXP i.MX8M Plus Processor up to 4 Arm Cortex A53 cores
  • LPDDR4 Memory Down Up to 8GB
  • Display Options: 1 LVDS, 1 HDMI
  • Multiple Expansion: 1 PCIe 3.0 x1, SPI, I2C, CAN
  • Rich I/O: 2 GbE LAN, 1 USB OTG, 2 USB 3.0, 4 USB 2.0

Status : Preliminary QUOTE NOW

Wide-temp: -40°C~85°C
Multiple Expansion
Dual Display
Rich I/O
LPDDR4
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RoHS Certification
CE Certification
FCC Certification

F8000 Related Tags

#LVDS#LPDDR4#NXP#eMMC#NXP i.MX8M Plus#1G Ethernet#Linux#HDMI#RoHS Certification#CE Certification#FCC Certification
F8000｜NXP｜System-On-Modules｜DFI
F8000｜NXP｜System-On-Modules｜DFI
F8000｜NXP｜System-On-Modules｜DFI

Related Products:

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System
Processor
NXP i.MX 8M plus Cortex-A53 processors
MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz
MIMX8ML8CVNKZAB (Industrial), Quad 1.6GHz
Memory
On-board 2/4/8GB LPDDR4
NPU
NPU
2.3 TOPS
Graphics
Controller
GC7000UL
Feature
HW Decode: 1080p60 H.265, H.264, VP9, VP8
HW Endcode: 1080p60 H.265, H.264
Display
1 x Dual-channel LVDS
1 x HDMI
Expansion
Interface
1 x PCIe x1 (Gen 3)
1 x SDIO 3.0
1 x I2C
2 x SPI
2 x 4-wire UART and 2 x 2-wire UART
2 x CAN bus
1 x 4-lanes MIPI-CSI, 1 x 2-lanes MIPI-CSI
Audio
Interface
1 x I2S
Ethernet
Controller
2 x 10/100/1000Mbps GbE
I/O
USB
1 x USB OTG
2 x USB 3.0
1 x USB 2.0 or 4 x USB2.0 thru USB HUB (available upon request)
eMMC
Supports eMMC 5.1 up to 128GB
GPIO
1 x 14-bit GPIO
Wireless
Wireless
IEEE 802.11 ac/a/b/g/n wireless LAN + Bluetooth 5.0 (available upon request)
Security
TPM
TPM 2.0 (available upon request)
Power
Type
5V DC-In
Consumption
TBD
OS Support
Linux
Linux Yocto
Environment
Temperature
Operating: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
SMARC form factor
82 mm (3.23") x 50 mm (1.97")
Compliance
SMARC specification revision 2.2 compliance
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
• 1 F8000 board
• Heat spreader
Country of Origin
Country of Origin
Taiwan
Product Collaterals
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    F8000-TC83     Part Number :
     770-F800001-000G     Description :
    4 CPU Cores, NPU, 8GB LPDDR4 memory, LVDS+HDMI, 1 USB 2.0, 32GB eMMC, Operating Temp.: -40 to 85°C
  • Model Name :
    F8000-TC41     Part Number :
     770-F800001-100G     Description :
    4 CPU Cores, NPU, 4GB LPDDR4 memory, LVDS+HDMI, 1 USB 2.0, 16GB eMMC, Operating Temp.: -40 to 85°C
  • Model Name :
    F8000-TC28     Part Number :
     770-F800001-200G     Description :
    2 CPU Cores, NPU, 2GB LPDDR4 memory, LVDS+HDMI, 1 USB 2.0, 8GB eMMC, Operating Temp.: -40 to 85°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    SMARC Carrier Board SMX331     Part Number :
         Description :
  • Item Name :
    Heat sink     Part Number :
         Description :

Working with DFI

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