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High Performance AMD Ryzen™ R2000 Processor-PCSF51

High Performance AMD Ryzen™ R2000 Processor-PCSF51

Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

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Creates New Smart Fleet Management Applications

VC900-M8M installed VicOne's vehicle network security solution, xCarbon, develope a smart city and construct an efficient and safe intelligent transportation system (ITS).

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PTH961｜Intel®｜System-On-Modules｜DFI

PTH961
Overview
Overview
Specification
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Home System-On-Modules COM Express Basic PTH961
  • UP to 64GB LPDDR5x- 8533 memory down
  • 8K High Resolution: Supports 8K / 4K resolution
  • Multiple Displays: 3 DDI, 1 LVDS/eDP
  • Multiple Expansion: Up to 20 PCIe Lanes
  • Rich I/O: 1 Intel 2.5GbE, 2 USB 4.0, 4 USB 3.2

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Multiple Expansion
Rich I/O
Multiple Displays
8K resolution
LPDDR5x
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RoHS Certification
CE Certification
FCC Certification

PTH961 Related Tags

#8K resolution#LVDS#eDP#SMBus#I2C#UART#LPDDR5x#Intel® Core™ Ultra processors #IoT#Intel#4K2K Display#Windows#Linux#Multiple Expansion#RoHS Certification#CE Certification#FCC Certification#2.5G Ethernet
PTH961｜Intel®｜System-On-Modules｜DFI

Related Products:

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System
Processor
Intel® Core™ Ultra Series 3 Processor Panther Lake
Intel® Core™ Ultra X7 358H (4 P-Cores x 1.9GHz, 8 E-Cores x 1.5GHz, 4 LP E-Cores x 1.5GHz, 18MB cache, 25W)
Intel® Core™ Ultra 5 325 (4 P-Cores x 2.1GHz, 4 LP E-Cores x 1.6GHz, 18MB cache, 25W)
Memory
Up to 64GB (optional to 96GB) LPDDR5x-8533 memory down (IBECC supported)
BIOS
AMI BIOS
Graphics
Controller
Intel® Arc Graphics or Intel® Gr aphics
Feature
DX12, Open GL 4.6, Vulkan 1.2
HW Decode: HEVC/VP9/SCC/AV1/AVC
HW Encode: HEVC/VP9/SCC/AVC
Display
3 x DDI (DDI3 co lay with USB3)
1 x LVDS/eDP
Expansion
Interface
404/12Xe sku:
Up to 8 x PCIe x1 (Gen4) + 1 x PCIe x4 (Gen5)
484 sku:
Up to 8 x PCIe x1 (Gen4) + 1 x PCIe x8 (Gen5) + 1 x PCIe x4 (Gen5)
1 x I2C
1 x SMBus
1 x eSPI
2 x UART
Audio
Audio Codec
HD Audio
Ethernet
PHY
1 x Intel® I226 series (10/100/1000/2500Mbps), co-lay 1 x PCIe x1 (available upon request)
I/O
USB
Up to 2 x USB 4.0 (co-lay with DDI, available upon request)
4 x USB 3.2 Gen.2
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s), co-lay PCIe x1 (available upon request)
DIO
1 x 8-bit DIO
NVMe SSD
1 x 128GB/256GB/512GB/1024GB on board SSD (available upon request)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
TPM 2.0
Power
Type
8.5V~20V, 5VSB, VCC_RTC (ATX mode)
8.5V~20V, VCC_RTC (AT mode)
Consumption
TBD
OS Support
Microsoft
Windows 11 IoT Enterprise 64-bit
Linux
Linux
Environment
Temperature
Operating: -40 to 85°C for ET CPU skus, 0 to 60°C,
Storage: -40 to 85°C
Humidity
Operating: 10 to 90% RH
Storage: 10 to 90% RH
MTBF
TBD
Mechanism
Dimensions
COM Express® Basic
125mm (4.92") x 95mm (3.74")
Compliance
PICMG COM Express® R3.1, Type 6
Standards and Certifications
Certifications
CE, FCC, RoHS
Country of Origin
Country of Origin
Taiwan
Product Collaterals

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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