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High Performance AMD Ryzen™ R2000 Processor-PCSF51

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F9000｜NXP｜System-On-Modules｜DFI

F9000
Overview
Overview
Specification
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Ordering Information
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Home System-On-Modules SMARC F9000
  • NXP i.MX95 series up to 6 Arm Cortex A55 cores
  • 4/8GB LPDDR5 Memory Down
  • Display Options: 1 Dual channel LVDS, 1 HDMI
  • Multiple Expansion: 2 PCIe 3.0
  • Rich I/O: 2 GbE LAN, 1 USB OTG, 1 USB 3.0, 5 USB 2.0

Status : Preliminary QUOTE NOW

Wide-temp: -40°C~85°C
Multiple Expansion
Rich I/O
LPDDR5
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RoHS Certification
CE Certification
FCC Certification

F9000 Related Tags

#LVDS#LPDDR5#NXP® i.MX 8M mini Series#eMMC#NXP i.MX95 Series#1G Ethernet#Linux#HDMI#RoHS Certification#CE Certification#FCC Certification
F9000｜NXP｜System-On-Modules｜DFI
F9000｜NXP｜System-On-Modules｜DFI
F9000｜NXP｜System-On-Modules｜DFI

Related Products:

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System
Processor
NXP i.MX95 series up to 6 Arm Cortex A55 cores, up to 2.0GHz
Memory
4/8GB LPDDR5-6400 Memory Down
Graphics
Controller
Arm® Mali™ G310 GPU
Feature
OpenGL ES 3.2 Vulkan 1.2, OpenCL 3.0
Display
1 x Dual channel LVDS (default)
1 x HDMI (BOM option)
Expansion
Interface
2 x PCIe x1 (Gen 3)
1 x SDIO 3.0
1 x I2C
2 x SPI
2 x 4-wire UART and 2 x 2-wire UART
2 x CAN bus
1 x 4-lanes MIPI CSI
Audio
Interface
1 x I2S
Ethernet
Controller
2 x 10/100/1000Mbps GbE
I/O
USB
1 x USB OTG
1 x USB 3.0
5 x USB 2.0 thru USB hub
eMMC
Supports eMMC 5.1, BGA-153 Ball up to 128GB
GPIO
1 x 14-bit GPIO
Security
FTPM
TPM 2.0
Power
Type
5V DC-In
Consumption
TBD
OS Support
OS Support (UEFI Only)
Linux Yocto
Environment
Temperature
Operating: -5 to 65°C or -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
SMARC form factor
82 mm (3.23") x 50 mm (1.97")
Compliance
SMARC specification revision 2.1 compliance
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
• 1 F9000 board
Country of Origin
Country of Origin
Taiwan
Product Collaterals
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    F9000-TC86-9596     Part Number :
     770-F900001-000G     Description :
    6 CPU Cores, 8GB LPDDR5 Memory Down, LVDS, TPM 2.0, 5 USB 2.0, 64GB eMMC, Operating Temp.: -40 to 85°C
Optional Items
  • Item Name Part Number Description
  • Item Name :
    SMARC Carrier Board     Part Number :
         Description :
  • Item Name :
    Heat spreader     Part Number :
         Description :
  • Item Name :
    Heat sink     Part Number :
         Description :

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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