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關於友通 新聞中心 DFI Cost-Efficient COM Express Basic Type 2 HM76-based Module Supports 3rd Gen Intel® Core™ Processor

DFI Cost-Efficient COM Express Basic Type 2 HM76-based Module Supports 3rd Gen Intel® Core™ Processor|新聞中心|DFI

DFI Cost-Efficient COM Express Basic Type 2 HM76-based Module Supports 3rd Gen Intel® Core™ Processor

2013/06/20 (UTC+8)

DFI, a leading provider offering a wide range of products for diversified industry applications, today launches the CR902-BL, a new Type of 2 COM Express basic form factor in its mobile Intel® HM76 product line. This embedded module with BGA 1023 packaging technology supports the 3rd/2nd generation Intel® Core™/Celeron™ processor family, the next generation of 64-bit, multi-core processor featuring 22/32-nanometer process technology. This new mobile platform supporting the 3rd generation premium performance i7-3615/3612QE, i7-3555LE, i7-3517UE and i5-3610ME, as well as the mainstream performance i3-3217UE and i3-3120ME provides higher performance, are more cost-efficient and lower power consumption than the 2nd generation processors which are also supported on this module. These processors offer higher processing performance, superior graphics display support, and evolutionary improvements in system memory and I/O interfaces. 

Support is provided with 2 DDR3/DDR3L SODIMM sockets that deliver up to 16GB or 1066/1067/1333/1600MHz low voltage memory for faster communication between components. The mobile-based Intel® HM76 express chipset packed with high performance and flexible I/O capabilities is used on this cost-efficient COM Express form factor to provide increased mobile computing and graphics performance.

The Intel® HD Graphics 4000/3000 engine integrated into these processors with high quality playback supports Intel® Clear Video Technology that supplies advanced imaging capabilities for Blu-Ray and other high definition video processing such as image stabilization, gamut mapping and frame rate conversion and delivers up to 50% significant 3D graphics performance improvement. Performance is further increased through the introduction of Intel® DirectX Video Acceleration (DXVA) for providing acceleration of complex audio, video, and image processing. Additional features supporting Graphics APIs, including DirectX 11/10.1/10/9 and OGL 3.0 provide integrated Intel® graphics accelerator with VGA and LVDS display ports with resolution up to 2048 x 1536.

The CR902-BL with high performance and flexible I/O provides HD Audio interface, 2 IDE devices, 8-bit Digital I/O connector for device controls, 1 Intel® Gigabit LAN controller to increase transmission speed for network-intensive applications, 1 LPC interface, 1 SMBus interface and 2 Digital Display Interfaces which multiplex PCIe x16. The Advanced Host Controller Interface (AHCI) controller integrated into the CR902-BL mobile module supports 4 Serial ATA interfaces: 2 Serial ATA 3.0 ports with speed up to 6Gb/s and 2 Serial ATA 2.0 ports with speed up to 3Gb/s for applications that need fast storage speed. With 8 USB 2.0 interfaces, this new mobile platform allows your system to process more data load and provides faster loading of frequently used applications.

To offer additional capabilities for customers’ various of demands, the CR902-BL basic form factor also comes with multiple expansion configurations, including 1 PCIe x16 slot multiplexing digital display interface for high performance graphics displays, 4 PCI (PCI 2.3) slots, and 1 PCIe x4 and 1 PCIe x1 slots; or 5 PCIe x1 slots.

Based on these combined features described above, this new mobile embedded module board, CR902-BL, is an ideal product for a whole range of applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.

CR902-BL Features:

• PICMG COM Express R2.1 basic form factor, Type 2 (95mm x 125mm)
• Supports Intel® Core™/Celeron™ 3rd/2nd Gen i7/i5/i3 processors (BGA 1023)
• Mobile Intel® HM76 Express Chipset
• Up to 16GB of DDR3/DDR3L 1066/1067/1333/1600MHz, dual-channel memory interface
• 1 LVDS and 1 VGA interfaces support 2 independent displays
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
   2 SATA 2.0 with data transfer rate up to 3Gb/s
• 8 USB 2.0 ports
• 1 Intel® Gigabit LAN interface
• 1 PCIe x16 slot
  1 PCIe x4 and 1 PCIe x1 slots; or 5 PCIe x1 slots
  4 PCI slots
• 1 LPC interface
• 2 IDE devices
• 1 SMBus interface
• 8-bit Digital I/O connector
• 2 DDI multiplex with PCIe x16
• Operating Temperature Range: 0°C to 60°C

All product specifications are subject to change without notice.

Intel® and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.

For more information, please call DFI sales or send us an e-mail: inquiry@dfi.com

For more information on the CR902-BL COM Express Basic Module, please visit: www.dfi.com


About DFI

Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Embedded Alliance (IEA), DFI works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.

DFI Inc.

100, Huanhe St., Xizhi Dist.,
New Taipei City 22154, Taiwan (R.O.C.)
Tel: +886 (2) 2694-2986
Fax: +886 (2) 2694-5815
Sales E-Mail: inquiry@dfi.com
Website: https://www.dfi.com/