CS331-Q370｜Intel®｜工业级主机板｜友通资讯 DFI

8th Generation Intel® Core™ /Pentium®/Celeron® LGA 1151 Socket
Processors:
Intel® Core™ i7-8700 (6 Cores, 12M Cache, up to 4.6 GHz); 65W
Intel® Core™ i7-8700T (6 Cores, 12M Cache, up to 4.0 GHz); 35W
Intel® Core™ i5-8500 (6 Cores, 9M Cache, up to 4.1 GHz); 65W
Intel® Core™ i5-8500T (6 Cores, 9M Cache, up to 3.5 GHz); 35W
Intel® Core™ i3-8100 (4 Cores, 6M Cache, 3.6 GHz); 65W
Intel® Core™ i3-8100T (4 Cores, 6M Cache, to 3.1 GHz); 35W
Intel® Pentium® G5400 (2 Cores, 4M Cache, 3.7 GHz); 58W
Intel® Pentium® G5400T (2 Cores, 4M Cache, 3.1 GHz); 35W
Intel® Celeron® G4900 (2 Cores, 2M Cache, 3.1 GHz); 54W
Intel® Celeron® G4900T (2 Cores, 2M Cache, 2.9 GHz); 35W
9th Generation Intel® Core™ LGA 1151 Socket Processors:
Intel® Core™ i7-9700TE (8 Cores, 12M Cache, up to 3.8 GHz); 35W
Intel® Core™ i5-9500E (6 Cores, 9M Cache, up to 4.2 GHz); 65W
Intel® Core™ i5-9500TE (6 Cores, 9M Cache, up to 3.6 GHz); 35W
Intel® Core™ i3-9100E (4 Cores, 6M Cache, 3.7 GHz); 65W
Intel® Core™ i3-9100TE (4 Cores, 6M Cache, to 3.2 GHz); 35W

Intel® Q370 Chipset

Four 288-pin DIMM up to 128GB
Dual Channel DDR4 2400/2666 MHz (non ECC support)

AMI SPI 128Mbit

Intel® HD Gen 9 Graphics

OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9

1 x HDMI
1 x DVI-I (DVI-D signal)
1 x DP++
HDMI 1.2: resolution up to 1920x1200 @ 60Hz
HDMI 2.0a: resolution up to 4096x2160 @ 60Hz (opt.)(MOQ required)
DVI-D: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2106 @ 60Hz

DVI-D + HDMI + DP++

2 x PCIe x16 (Gen 3) (1 x16 signals or 2 x8 signals)
2 x PCIe x4 (Gen 3)
1 x mini PCIe (PCIe/mSATA/USB2.0)
1 x M.2 2242/2260/2280 M key (PCIe Gen3 x 4 NVMe)

Realtek ALC888

1 x Intel® i219LM PCIe (10/100/1000Mbps) with iAMT 12.0 (only Core i7/i5 supports iAMT)
1 x Intel® i211AT PCIe (10/100/1000Mbps)

2 x GbE (RJ-45)

1 x RS-232/422/485 (RS-232 w/ power) (DB-9)

2 x USB 3.1 Gen 2
2 x USB 3.1 Gen 1
2 x USB 2.0

1 x PS/2 (mini-DIN-6)

1 x HDMI
1 x DVI-I (DVI-D signal)
1 x DP++

1 x Line-out
1 x Line-in (colay, opt. by request, MOQ required)
1 x Mic-in

1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
2 x RS-232

2 x USB 3.1 Gen 2
4 x USB 2.0 (2.54mm pitch) (1 x USB 2.0 colay vertical Type A) (opt. by request, MOQ required)

1 x S/PDIF, 1 x Front Audio Header

5 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10

1 x 8-bit DIO

1 x LPC (support LPC EXT-RS-232/485 module)

1 x SMBus

System Reset, Programmable via Software from 1 to 255 sec/min

Infi neon TPM 1.2/2.0 (Available Upon Request, MOQ required)

ATX

8-pin ATX 12V power
24-pin ATX power

Typical: i7-8700K: 3.3V @ 0.13A (0.429Watt); 5V @ 0.46A (2.3Watt); 12V @ 0.31A (3.72Watt)
Max.: i7-8700K:3.3V @ 0.22A (0.726Watt); 5V @ 1.21A (6.05Watt); 12V @ 11.31A (135.72Watt)

CR2032 Coin Cell

Windows 10 IoT Enterprise 64-bit
Linux

Operating: 0 to 60°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery

Operating: 5 to 90% RH
Storage: 5 to 90% RH

554,887 hrs @ 25°C; 312,271 hrs @ 45°C ; 193,870 hrs @ 60°C
Calculation Model: Telcordia Issue 4
Environment: GB, GC - Ground Benign, Controlled

microATX form factor
244mm (9.6") x 244mm (9.6")

PCB: 1.6mm
Top Side: 31.51mm
Bottom Side: 4.4mm

CE, FCC, RoHS

1 CS331-Q370 motherboard
1 COM port cable
(W/Bracket, Length: 300mm, 2 x COM ports): A81-015026-023G
1 Serial ATA data cable (W/LOCK, Length: 500mm): 332-553001-005G
1 I/O shield: A49-CS3311-001G
1 M.2 2242/2260/half mini PCIe standoff A33-725019-090G
2 M.2 Screw A32-112016-041G