We have noticed that you are visiting from North American areas. Would you like to browse the US site (US.DFI.com) for a better experience?

可以请您回答一个简短的问卷吗?

感谢您填写这份问卷。您的反馈将有助于改进我们的网站,并提供更好的用户体验。

您的反馈建议已成功送出,非常感谢您的参与。

关闭

VC500-CMS-MXM|Intel®| 工业级系统|友通资讯 DFI

VC500-CMS-MXM
首页 特定应用系统 车载专用系统 VC500-CMS-MXM
  • High Performance Fan-less Edge AI In-Vehicle System
  • Supports 10th Gen Intel® Xeon/Core™/Pentium/Celeron Processors
  • 4x M12/RJ45 802.11af PoE or 2x 10G SFP+ Ports
  • Supports MXM GPU module with Four Display Ports
  • 1 miniPCIe and 4 M.2 slots for CAN bus/LTE/5G/WiFi/Storage modules
  • Supports M.2 B key 3042/3052 5G-NR module with dual SIM
  • OOB management support upon request
  • 15-Year CPU Life Cycle Support Until Q1' 34 (Based on Intel IOTG Roadmap)

状态 : 初版 前往询价

无风扇设计
Mini PCIe扩充插槽
多元扩充插槽
CPU 15年生命周期支持
DDR4内存
产品比较
目前共有 样产品 ,Up to 3 items.
前往比较
加入询价表
目前共有 ,Up to 3 items.
前往询价
FCC 认证
E-Mark (E13) Certification

VC500-CMS-MXM 相关标签

#OOB#Edge#AI#Intel#SIM卡槽#5G#PoE#CAN-Bus#Mini PCIe#无风扇设计#Linux#HDMI#DP#多元扩充插槽#DDR4内存#E-Mark (E13)认证#FCC认证#车载#Intel® 第10代 Comet Lake 处理器
VC500-CMS-MXM|Intel®| Industrial Computers |DFI
VC500-CMS-MXM|Intel®| Industrial Computers |DFI
VC500-CMS-MXM|Intel®| Industrial Computers |DFI
VC500-CMS-MXM|Intel®| Industrial Computers |DFI
VC500-CMS-MXM|Intel®| Industrial Computers |DFI
系统
处理器
10th Gen Intel® Xeon/Core™/Pentium/Celeron Processors, LGA 1200 Socket
- Intel® Xeon-1270TE (8 Cores, 16M Cache, up to 2.0/4.4 GHz); 35W
- Intel® Core™ i9-10900TE (10 Cores, 20M Cache, up to 1.8/4.5 GHz); 35W
- Intel® Core™ i7-10700TE (8 Cores, 16M Cache, up to 2.0/4.4 GHz); 35W
- Intel® Core™ i5-10500TE (6 Cores, 12M Cache, up to 2.3/3.7 GHz); 35W
- Intel® Core™ i3-10100TE (4 Cores, 6M Cache, to 2.3/3.6 GHz); 35W
芯片组
Intel® Q470E/W480E Chipset
内存
Dual SO-DIMM slots (horizontal type) with anti-vibration bracket
Dual Channel DDR4 2933/2666/2400/2133 SDRAM, up to 64GB
ECC support for Xeon-1270TE processor only
BIOS
AMI SPI 256Mbit
显示
控制器
Intel® processor integrated or Independent MXM module by BIOS selection
显示器
4 x Display Ports with lock holes from MXM
1 x HDMI combo port and 2 x DP++ ports from CPU
Compatible MXM
Type A or B MXM modules: RTX A2000, RTX3000, A500, A1000
储存
外插
2 x swappable 2.5" SATA drive bays with lock on rear panel
Supports RAID 0/1
内插
1 x M.2 2280 M Key slot, supports 2242, 2260 & 2280 devices
PCIe x4 & SATA signal, support boot up function
界面
SATA
音讯
音讯编译码器
ALC 888
界面
1 x Mic-in
1 x Line-in
以太网路
控制器
1 x Intel® i219LM with iAMT11.0 support (Core i7/i5 only)
1 x Intel® i210IT
LED
指示灯
1 x Storage Activity (Red)
1 x Power (Green)
2 x Programmable general purpose (Green, Blue)
前板输入/输出
以太网络
2 x RJ45 GbE ports
串口
1 x DB-9 RS232 ports (COM 5)
USB
4 x USB 3.1 Gen2
音源
1 x Line-out, 1 x Mic-in and 1x Line-in with 3.5mm audio jacks
DIO
2 x Isolated DIO port by 2 x DB-15 female connectors
Supports 8bit DI & 8 bit DO with 2KV isolation
天线
2 x antenna holes
DC in
W3 3 pin connector
带外管理
Optional RJ45 port for OOB management
PoE/ 10G
4 x 802.11af PoE ports at RJ45 or M12 X-coded connectors, max 15.4W (PSE side) or
2 x 10G fiber ports at SFP+ cage based on Intel X710-BM2 Ethernet controller
背板输入/输出
串口
4 x DB-9 RS232/422/485 ports by BIOS selection (COM 1/2/3/4)
USB
4 x USB 3.1 Gen2
显示
4 x Display Ports with lock holes from MXM
1 x DP++/HDMI combo port and 2 x DP++ ports from CPU
按键
1 x Power Button
1 x Reset Button
切换
2-pin remote switch
天线
2 x antenna holes
SIM
3 x accessible SIM slots with cover bracket
CANBus
2 x DB-9 ports for CAN bus (optional)
侧面输入/输出
天线孔
2 x antenna holes on right side
2 x antenna holes on left side
内部输入/输出
串行端口
1 x 2x5 pin block header for RS232
Mini PCIe
1 x mini PCIe slot with SIM holer on faceplate
Supports WiFi/BT/LTE or CAN bus module
M.2
Total 3 x M.2 slots
1 x 2230 E-key slot (PCIe x1 & USB2.0)
1 x 3042/3052 B-Key (USB3.0 & PCIex1) with dual SIM slots on faceplate
1 x 2242/2280 M-Key-slot (PCIe gen3 x4 & SATA) supporting Intel® Optane memory (Both of the M10 and H10) and NVMe
冷却
风扇
Passive cooling by default
Optional Fan cooling upon request
安全性
信赖平台模块
Supports dTPM2.0 by default (disabled by BIOS setting)
Optional fTPM2.0 supported
Hardware Monitor
重力感应器
Support 3-axis femto accelerometer
User-selectable ±2g/±4g/±8g/±16g scale
Supports 6D/4D orientation detection, Free-fall detection, Motion detection and leep-towake
and return-to-sleep
电源
类型
3pin 3W3 connector
供应
Wide Range 9~50VDC with power management (on/off delay) and ignition
支持操作系统
微软
Windows 10 IoT Enterprise RS5
Windows 11 IoT Enterprise LTSC SW
Linux
Ubuntu Linux 20.04
环境指标
运作温度
-20°C to 60°C
without turbo boost and throttling is expected
储存温度
-40°C to 85°C
相对湿度
10% to 95% (non-condensing)
机械结构
结构
Metal + Aluminum
安装方式
Wall mount
尺寸 (宽 x 高 x 深)
346mm x 87.55 mm x 221mm
重量
6.95 Kg
颜色
Black and Silver
安规认证
冲击测试
MIL-STD-810G Method 516.6, Procedure 1, OP:10G 11ms, Non-OP: 40G 11ms (Test by
SSD, HDD is not support)
抗振动测试
MIL-STD-810G Method 514.6C-3, Category 4 Composite wheeled vehicle Table 514.6C-VI
认证
FCC, E-Mark
装箱单
装箱单
1 VC500-CMS-MXM system unit
1 Power connector
1 Mounting bracket
1 3W3 adaptor cable
订购资讯
  • 型号 料号 描述
  • 型号 :
    VC500-CMS-MXM-10G-Q
    料号 :
    750-VC50000-400G
    描述 :
    Intel® Q470E Chipset, 8 USB 3.1, 1 DI, 1 DO, 2 10GLAN, 1 MXM slot, Power: 3pin 3W3 connector
  • 型号 :
    VC500-CMS-MXM-POE-Q
    料号 :
    750-VC50000-500G
    描述 :
    Intel® Q470E Chipset, 8 USB 3.1, 1 DI, 1 DO, 4 (RJ45) POE, 1 MXM slot, Power: 3pin 3W3 connector
  • 型号 :
    VC500-CMS-A1000-POE-Q-i70
    料号 :
    750-VC50000-510G
    描述 :
    Intel® Core™ i7-10700TE, Intel® Q470E Chipset, 8 USB 3.1, 1 DI, 1 DO, 4 (RJ45) POE, 1 MXM-A1000 slot, Power: 3pin 3W3 connector
选购品
  • 品名 料号 描述
  • 品名 :
    2.5" SSD
    料号 :
    785-S251TBG
    785-S25512G
    785-S25256G
    785-S25128G
    描述 :
    2.5" SATA SSD, 1TB MLC, -40 to 85°C, RoHS
    2.5" SATA SSD, 512GB MLC, -40 to 85°C, RoHS
    2.5" SATA SSD, 256GB MLC, -40 to 85°C, RoHS
    2.5" SATA SSD, 128GB MLC, -40 to 85°C, RoHS
  • 品名 :
    M.2 SATA SSD
    料号 :
    785-M2SATA64G
    785-M2SATA128G
    785-M2SATA256G
    785-M2SATA512G
    描述 :
    64GB, M.2 2280 SSD, SATA3 B+M Key, MLC, Wide Temp.
    128GB, M.2 2280 SSD, SATA3 B+M Key, MLC, Wide Temp.
    256GB, M.2 2280 SSD, SATA3 B+M Key, MLC, Wide Temp.
    512GB, M.2 2280 SSD, SATA3 B+M Key, 3D TLC, PE: 3K, 30u” -20~75°C
  • 品名 :
    Memory
    料号 :
    138-540002-121G
    138-580004-104G
    描述 :
    4GB DDR4 2666Mhz SO-DIMM, -40 to 85°C
    8GB DDR4 2666Mhz SO-DIMM 1Rx8 IND 1Gx8 CL19 1.2V
  • 品名 :
    WiFi/BT module kit
    料号 :
    761-AP1235-000G
    描述 :
    WiFi/Bluetooth Module AP12356, antenna *2, 200mm SMA cables*2, Mini PCIe Bracket, screws
  • 品名 :
    LTE module kit
    料号 :
    761-RC3000-001G
    描述 :
    Quectel EG25GGB CAT4 miniPCIe module, antenna*2, 300mm SMA cables*2
  • 品名 :
    5G module kit
    料号 :
    761-RC3000-100G
    描述 :
    SIM8202G-M2 M.2 module, antenna*4, 184mm SMA cables *4
  • 品名 :
    M12 Cable
    料号 :
    A81-005038-054G
    描述 :
    8-pin M12 X-coded to RJ45 PoE cable
  • 品名 :
    CAN bus module
    料号 :
    770-MPEC21-100G
    描述 :
    MPE-CAN2 MiniPCIe Full CAN Module Card Asssembly
  • 品名 :
    Power Switch Cable
    料号 :
    A81-004363-054G
    描述 :
    3W3 to terminal block 2*4P/4.2mm, L=250 & 300mm with ignition switch button
  • 品名 :
    Power Adapter
    料号 :
    671-133001-000G
    描述 :
    330W, GST360A, Input: 85~264V, Output: 12V/27.5A, 220x95x46mm, L=1000mm, C8P, LV6, 62368-1, GST360A12-C8P(MEAN WELL)RoHS

与友通合作

友通定制化服务(DCS)具备完整的技术支持和专业团队,为设计,生产,保修,维修至产品生命周期管理,我们提供完整的服务。为了使您的专案能顺利进行,友通将与您密切合作,了解您的设计需求,并在产品开发阶段提供即时技术支持,降低您的开发成本和投入。

让我们开始吧