We have noticed that you are visiting from North American areas. Would you like to browse the US site (US.DFI.com) for a better experience?

可以请您回答一个简短的问卷吗?

感谢您填写这份问卷。您的反馈将有助于改进我们的网站,并提供更好的用户体验。

您的反馈建议已成功送出,非常感谢您的参与。

关闭

RPS330-Q670E/H610E|Intel®|工业级主机板|友通资讯 DFI

RPS330-Q670E/H610E
首页 工业级主机板 microATX RPS330-Q670E/H610E
  • 14th Gen Intel® Core™ with Intel® Q670E/H610E chipset
  • 4 DDR5 UDIMM up to 128GB
  • Supports 3 independent displays: VGA, DP++, HDMI
  • Supports 4K resolution
  • Multiple Expansion: 1 PCIe x16, 1 PCIe x4, 2 PCI, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
  • Rich I/O: 1 Intel 2.5GbE, 1 Intel 1GbE, 6 COM, USB 3.2 Gen 2 (Q670E 4x), USB 3.2 Gen 1 (Q670E 6x, H610E 4x), USB 2.0 (Q670E 7x, H610E 6x)

状态 : 初版 前往询价

4K2K高清
多元扩充插槽
三个独立显示
DDR5内存
丰富 I/O
2.5Gb以太网络
产品比较
目前共有 样产品 ,Up to 3 items.
前往比较
加入询价表
目前共有 ,Up to 3 items.
前往询价
RoHS 认证
CE 认证
FCC 认证

RPS330-Q670E/H610E 相关标签

#DDR5内存#Windows 10#14th Gen Intel® Core™ 处理器#IoT#Intel#4K2K高清#1Gb以太网络#PCIe x16扩充插槽#Windows#Linux#HDMI#VGA#DP#多元扩充插槽#12V DC-in#RoHS认证#CE认证#FCC认证#2.5Gb乙太網路
RPS330-Q670E/H610E
RPS330-Q670E/H610E|Intel®|Industrial Motherboards|DFI
RPS330-Q670E/H610E|Intel®|Industrial Motherboards|DFI
RPS330-Q670E/H610E|Intel®|Industrial Motherboards|DFI
系统
处理器
14th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ I9-14900 (24 Cores, 36M Cache, up to 2.0 GHz); 65W
Intel® Core™ I9-14900T (24 Cores, 36M Cache, up to 1.1 GHz); 35W
Intel® Core™ I7-14700 (20 Cores, 33M Cache, up to 2.1 GHz); 65W
Intel® Core™ I7-14700T (20 Cores, 33M Cache, up to 1.3 GHz); 35W
Intel® Core™ I5-14500 (14 Cores, 24M Cache, up to 2.6 GHz); 65W
Intel® Core™ I5-14500T (14 Cores, 24M Cache, up to 1.7 GHz); 35W
Intel® Core™ I3-14100 (4 Cores, 12M Cache, up to 3.5 GHz); 60W
Intel® Core™ I3-14100T (4 Cores, 12M Cache, up to 2.7 GHz); 35W
Intel® 300T (2 Cores, 6M Cache, up to 3.4 GHz); 35W
芯片组
Intel® Q670E/H610E Chipset
内存
Four 288-pin UDIMM up to 128GB (ECC/Non-ECC)
Dual Channel DDR5 up to 4400 MHz
*Speed support list follow User’s Manual
BIOS
AMI SPI 256Mbit
显示
控制器
Intel® HD Gen 9 Graphics
特性
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
显示器
1 x VGA
1 x DP++
1 x HDMI 2.0a

VGA: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2304 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz
三重显示
VGA + DP++ + HDMI
扩充
界面
1 x PCIe x16 (Gen 5)
1 x PCIe x4 (Gen 3) (co-lay M.2 M-key, function selected by BIOS.)
2 x PCI

1 x M.2 2230 E key (only Q670E support, PCIe/USB 2.0/Intel CNVi support) (Discrete Wifi 6E support)
1 x M.2 2242/2260/2280 M key (PCIe x2 NVMe/SATA/Intel RST support)
1 x M.2 2242/2260/2280 M key (PCIe x4 NVMe/Intel RST support) (co-lay PCIE x4 slot, function selected by BIOS.)
音讯
音讯编译码器
Realtek ALC888
以太网路
控制器
[RPS330-Q670E] 1 x Intel® I219-LM (Core i9/i7/i5 support iAMT, co-lay I226-LM)
[RPS330-H610E] 1 x Intel® I219-V (co-lay I226-V)
1 x Intel® I226-V
背板输入/输出
以太网络
1 x 2.5GbE (RJ-45)
1 x 1GbE (RJ-45)
串口
1 x RS-232/422/485 (RS-232 w/ power) (DB-9)
USB
[RPS330-Q670E] 4 x USB 3.2 Gen 2
[RPS330-H610E] 4 x USB 3.2 Gen 1
2 x USB 2.0
PS/2
1 x PS/2 (mini-DIN-6)
显示
1 x DP++
1 x HDMI 2.0a
1 x VGA
音源
1 x Line-out
1 x Mic-in
1 x Line-in (opt. by request, MOQ required)
内部输入/输出
串行端口
1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
4 x RS-232 (2.54mm pitch)
USB
[RPS330-Q670E] 2 x USB 3.2 Gen1
[RPS330-Q670E] 4 x USB 2.0 (2.54mm pitch)
[RPS330-Q670E] 1 x USB 2.0 vertical Type A
[RPS330-H610E] 2 x USB 2.0 (2.54mm pitch)
[RPS330-H610E] 2 x USB 2.0 (2.54mm pitch), co-lay 1 x USB 2.0 vertical Type A
音效
1 x Front Audio Header
1 x S/PDIF
SATA
4 x SATA 3.0 (up to 6Gb/s) (one port co-lay M.2 M-key (SATA))
[RPS330-Q670E] (RAID 0/1/5/10)
DIO
4-IN / 8-OUT DIO
SMBus
1 x SMBus
监视定时器
看门狗定时器
System Reset, Programmable via Software from 1 to 255 Seconds
安全性
信赖平台模块
Nuvoton TPM 2.0
电源
类型
ATX
端口
8-pin ATX 12V power
24-pin ATX power
耗能
TBD
RTC 电池
CR2032 Coin Cell
支持操作系统
微软
Windows 10 IoT Enterprise 64-bit
Windows 11 Enterprise
Linux
Linux
环境指标
温度
Operating: -5 to 65°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery
湿度
Operating: 5 to 95% RH
Storage: 5 to 95% RH
MTBF
TBD
机械结构
尺寸
microATX Form Factor
244mm (9.6") x 244mm (9.6")
高度
PCB: 1.6mm
Top Side: TBD
Bottom Side: TBD
安规认证
认证
CE, FCC Class B, RoHS
装箱单
装箱单
• 1 RPS330-Q670E/H610E motherboard
• 1 COM port cable (Length: 300mm, 2 x COM ports), A81-015026-023G
• 1 Serial ATA data cable (Length: 500mm), 332-553001-005G
• 1 I/O shield

与友通合作

友通定制化服务(DCS)具备完整的技术支持和专业团队,为设计,生产,保修,维修至产品生命周期管理,我们提供完整的服务。为了使您的专案能顺利进行,友通将与您密切合作,了解您的设计需求,并在产品开发阶段提供即时技术支持,降低您的开发成本和投入。

让我们开始吧