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RPS183|Intel®|工业级主机板|友通资讯 DFI

RPS183
首页 工业级主机板 Mini-ITX RPS183
  • 14th/13th/12th Gen Intel® Core Processors
  • 2 DDR5 SODIMM up to 64GB
  • Multiple Display: 1 DP++(CPU), 1 DP++(MXM), 1 USB Type C(DP Alt-mode), 1 eDP(MXM), 1 internal HDMI(MXM)
  • Support MXM module, with 1 internal HDMI, 1 eDP and 1 external DP++
  • Multiple Expansion: 1 PCIe x4(side), 1 M.2 M key, 1 M.2 E Key, 1 M.2 B Key
  • Rich I/O: 2 Intel® 2.5GbE, up to 4 USB 3.2 Type A, up to 1 USB Type C
  • Wide Range power input 19~24V
  • Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.

状态 : 初版 前往询价

宽压: 19~24V DC-in
多元扩充插槽
DDR5内存
丰富 I/O
CPU 10年生命周期支持
多重显示
产品比较
目前共有 样产品 ,Up to 3 items.
前往比较
加入询价表
目前共有 ,Up to 3 items.
前往询价
RoHS 认证
CE 认证
FCC 认证

RPS183 相关标签

#12th Gen Intel® Core™ 处理器#DDR5内存#13th Gen Intel® Core™ 处理器#Windows 10#USB Type-C DP#I2C#M.2#MXM#14th Gen Intel® Core™ 处理器#Windows 11#Intel#1Gb以太网络#Linux#DP#多元扩充插槽#RoHS认证#CE认证#FCC认证#2.5Gb乙太網路
RPS183|Intel®|Industrial Motherboards|DFI
RPS183|Intel®|Industrial Motherboards|DFI
RPS183|Intel®|Industrial Motherboards|DFI
RPS183|Intel®|Industrial Motherboards|DFI
RPS183-A2000|Intel®|Industrial Motherboards|DFI
RPS183-A4500|Intel®|Industrial Motherboards|DFI
系统
处理器
14th Generation Intel® LGA 1700 Socket Processors, TDP support up to 65W
Intel® Core™ I9-14900 (24 Cores, 36M Cache, up to 5.8 GHz); 65W
Intel® Core™ I9-14900T (24 Cores, 36M Cache, up to 5.5 GHz); 35W
Intel® Core™ I7-14700 (20 Cores, 33M Cache, up to 5.4 GHz); 65W
Intel® Core™ I7-14700T (20 Cores, 33M Cache, up to 5.2 GHz); 35W
Intel® Core™ I5-14500 (14 Cores, 24M Cache, up to 5.0 GHz); 65W
Intel® Core™ I5-14500T (14 Cores, 24M Cache, up to 4.8 GHz); 35W
Intel® Core™ I5-14400 (10 Cores, 20M Cache, up to 4.7 GHz); 65W
Intel® Core™ I5-14400T (10 Cores, 20M Cache, up to 4.5 GHz); 35W
Intel® Core™ I3-14100 (4 Cores, 12M Cache, up to 4.7 GHz); 60W
Intel® Core™ I3-14100T (4 Cores, 12M Cache, up to 4.4 GHz); 35W
Intel® 300 (2 Cores,6M Cache, 3.9 GHz); 46W
Intel® 300T (2 Cores, 4M Cache, 3.4 GHz); 35W

13th Generation Intel® LGA 1700 Socket Processors, TDP support up to 65W
Intel® Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W
Intel® Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W
Intel® Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W
Intel® Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W
Intel® Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W
Intel® Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W
Intel® Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W
Intel® Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W
Intel® Core™ I3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); 60W
Intel® Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W
Intel® Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W

12th Generation Intel® LGA 1700 Socket Processors, TDP support up to 65W
Intel® Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); 65W
Intel® Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); 65W
Intel® Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); 35W
Intel® Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); 65W
Intel® Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); 35W
Intel® Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); 60W
Intel® Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); 35W
Intel® Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); 46W
Intel® Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); 35W
Intel® Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); 46W
Intel® Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz); 35W
芯片组
Intel® Q670E/H610E Chipset
内存
2x 262-pin SODIMM up to 64GB
Dual Channel DDR5 4800MHz
BIOS
AMI SPI 256Mbit
显示
控制器
Intel® UHD Graphics 700 series
特性
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
显示器
1 x DP++ (CPU): Resolution up to 4096x2304 @ 60Hz
1 x DP++ (MXM): Resolution by MXM
1 x USB Type C: DP Alt-mode, Resolution up to 4096x2304 @60Hz
1 x eDP(MXM): Resolution by MXM
1 x Internal HDMI: Resolution by MXM
多重显示
1 DP++(CPU) + 1 DP++(MXM) + 1 USB Type C(DP Alt-mode) + 1 eDP(MXM) + 1 internal HDMI(MXM)
扩充
界面
1x PCIe Gen 3 x4 (Locate at board side)
1x M.2 2280 M Key (PCIE Gen3x4, SATA3)
1x M.2 2230 E Key (PCIE Gen3x, USB 2.0, support Intel® CNVi)
1x MXM Type-A/B/B+/C
[Q670E]1x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen2, USB 2.0)
[H610E]1x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen1, USB 2.0)
音讯
音讯编译码器
Realtek ALC888S
以太网路
控制器
[Q670E]1 x Intel® I226LM(vPro) (10/100/1000/2500Mbps)
[Q670E]1 x Intel® I226V (10/100/1000/2500Mbps)
[H610E]1 x Intel® I219V (10/100/1000/2500Mbps)
[H610E]1 x Intel® I226V (10/100/1000/2500Mbps)
背板输入/输出
以太网络
2 x 2.5GHz RJ45
USB
[Q670E]4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2+ 1 x USB Type C
[H610E]2 x USB 3.2 Gen2 + 2 x USB 2.0 or 2 x USB3.2 Gen2 + 1 x USB Type C
显示
1 x DP++, 1 DP++(MXM)
1 x USB Type C
音源
1 Audio Jack (Line-out/Mic-in)
内部输入/输出
串行端口
2 x RS-232/422/485
USB
1 x USB 2.0 Type A
显示
1 x eDP(MXM)
1 x HDMI(MXM)
SATA
1 x SATA 3.0
DIO
1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm)
I2C
2 x I2C (BOX HEADER, 1*8P/1.0m)
风扇
1 x CPU, 2 x System (WAFER,1*4P/1.25mm)
SPI
1 x SPI (BOX HEADER 1*6P/1.25mm)
监视定时器
看门狗定时器
System Reset, Programmable via Software from 1 to 255 Seconds
安全性
信赖平台模块
dTPM (default)
fTPM (option)
电源
类型
DC IN
端口
4-pin Teminal 19~24V DC-In
耗能
TBD
RTC 电池
CR2032 Coin Cell
支持操作系统
微软
Windows IoT Enterprise 10 LTSB, Windows 11 IoT Enterprise(64-bit)_23H2
Linux
Linux Ubuntu 22.04
环境指标
温度
Operating w/o MXM: -5°C ~ 65°C
Operating w/i MXM: By MXM spec
Storage: -40°C ~ 85°C
湿度
Operating: 5% ~ 90% RH
Storage: 5% ~ 90% RH
MTBF
TBD
机械结构
尺寸
195mm (7.7") x 170mm (6.7")
高度
PCB: 1.6mm
Top Side: TBD
安规认证
认证
CE, FCC, RoHS
装箱单
装箱单
1 RPS183 motherboard
1 Serial ATA data cable (Length: 500mm)
1 I/O shield (P/N: TBD)
3 M.2 screw/standoff
订购资讯
  • 型号 料号 描述
  • 型号 :
    RPS183-H610EDB
    料号 :
    770-RPS1831-000G
    描述 :
    RPS183-H610EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 2 USB 3.2 Gen2, 1 USB Type C), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C
  • 型号 :
    RPS183-Q670EDB
    料号 :
    770-RPS1831-100G
    描述 :
    RPS183-Q670EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C
  • 型号 :
    RPS183-H610EDB
    料号 :
    770-RPS1831-200G
    描述 :
    RPS183-H610EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 2 USB 3.2 Gen2, 2 USB 2.0 Type A), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C
  • 型号 :
    RPS183-Q670EDB
    料号 :
    770-RPS1831-300G
    描述 :
    RPS183-Q670EDB, 2 DDR5, Rear I/O (2 DP*++, 2 LAN, 4 USB 3.2 Gen2), Internal I/O (1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*, 2 USB 3.2 Gen1, 1 USB 2.0 Type A), w/TPM, DC19~24V, -5 to 65°C

* (NOTE: * Full functionality requires MXM implementation)

选购品
  • 品名 料号 描述
  • 品名 :
    Active Thermal Solution(65W)
    料号 :
    A71-101137-000G
    描述 :
    Thermal solution (For 65W, Height: 46mm)
  • 品名 :
    Active Thermal Solution(35W)
    料号 :
    A71-101136-000G
    描述 :
    Thermal solution (For 35W, Height: 39mm)
  • 品名 :
    PSU(450W, 24V)
    料号 :
    TBD
    描述 :
    Meanwell HRP-450-24
  • 品名 :
    Power adapter (360W, 24V)
    料号 :
    TBD
    描述 :
    Meanwell GST360B24-C6P
  • 品名 :
    Power adapter (160W, 24V)
    料号 :
    671-116005-000G
    描述 :
    Meanwell GST160A24-DFIA
  • 品名 :
    Power terminal converting cable (Spade-to-Phoenix 4P)
    料号 :
    TBD
    描述 :
    20cm, for Meanwell HRP-450-24
  • 品名 :
    Power terminal converting cable (ATX 6P-to-Phoenix 4P)
    料号 :
    TBD
    描述 :
    20cm, for Meanwell GST360B24-C6P
  • 品名 :
    Power terminal converting cable (DC5.5-to-ATX 2x2P)
    料号 :
    A81-004110-009G
    描述 :
    20cm, for Meanwell GST160A24-DFIA

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