DFI today introduces a new Type 6 COM Express Compact form factor, the HR908-B, in its Mobile product line based on the Intel® Core™ QM67 Express chipset. HR908-B is DFI's new model that supports the low-power and cost-efficient 3rd/2nd generation Intel® Core™ and Intel® Celeron™ processors with BGA 1023 packaging technology. The supported processors are built on Intel's 22/32-nanometer process technology and also offer higher performance at lower power consumption than the 2nd generation processors which are also supported on this mobile platform.
The integrated next-generation Intel® HD Graphics 4000/3000 engine supports high-end enhanced media and graphics capabilities and improves performance. The Intel® Clear Video Technology offers advanced imaging capabilities for Blu-Ray and other high definition video processing such as image stabilization, gamut mapping and frame rate conversion. Performance is further increased through the introduction of DirectX Video Acceleration(DXVA) for providing acceleration of complex audio,video, and image processing. Targeted at medical and gaming applications, HR908-B brings enhanced graphics performance with Graphics APIs, including DirectX 11/10.1/10/9, and OpenGL 3.0, to support 3 display outputs in any combinations of VGA, LVDS and DDI (HDMI, DVI and Display Port) interfaces allowing you to choose the best combination to suit various requirements.
In system memory, the HR908-B mobile platform is equipped with one 204-pin DDR3/DDR3L SODIMM socket supported by DRAM device technologies for x8 and x16 devices to deliver maximum performance up to 8GB at 1066/1333/1600MHz for faster communication between components. Based on the application of Mobile Intel® QM67 Express chipset, the HR908-B COM Express Compact form factor is designed with high performance and flexible I/O to provide increased mobile computing and graphics performance, including High Definition Audio interface, 4-bit input and 4-bit output GPIO connector for device controls, 1 Intel® Gigabit LAN controller integrated up to 1GB transceiver in order to increase transmission speed for network-intensive applications, 1 I2C interface, 1 SMBus interface. The Advanced Host Controller Interface (AHCI) controller integrated into the HR908-B mobile platform supports 4 Serial ATA interfaces: 2 Serial ATA 3.0 ports with speed rate up to 6Gb/s and 2 Serial ATA 2.0 ports with speed rate up to 3Gb/s for RAID 0/1/5/10. With 8 USB 2.0 interfaces, this new mobile platform allows your system to process more data load and provides faster loading of frequently used applications.
In addition, the HR908-B form factor also supports multiple PCIe expansion configurations to offer additional capabilities for customers' various demands. 1 PCIe x16 interface, and 1 PCIe x4 and 3 PCIe x1 interfaces (default); or 7 PCIe x1 interfaces are available for high performance graphics displays. The HR908-B mobile platform keeps steady for various environments when operating at the temperature range from 0°C to 60°C and the humidity range from 10% to 90%.
The HR908-B, a new COM Express Compact form factor combined with these features as described above, is an ideal product for a whole range of applications which require a stable revision-controlled platform, such as industrial control automation, digital signage, medical equipment, and KIOSK embedded applications.
• PICMG COM Express R2.1 Compact form factor, Type 6 (95mm x 95mm)
• Supports Intel® Core™ 3rd/2nd generation i7/i5/i3 processors (BGA 1023)
• Intel® QM67 Express chipset
• Up to 8GB of DDR3/DDR3L 1066/1333/1600MHz memory interface
• LVDS, VGA and DDI interfaces support 3 display outputs
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• 8 USB 2.0 ports
• 1 Intel® Gigabit LAN interface
• 1 PCIe x16 interface
1 PCIe x4 and 3 PCIe x1 interfaces; or 7 PCIe x1 interfaces
• 1 I2C interface
• 1 SMBus interface
• 4-bit input and 4-bit output GPIO connector
• Operating Temperature Range: 0°C to 60°C; Humidity Range: 10% to 90%
All product specifications are subject to change without notice.
Intel® and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an email: firstname.lastname@example.org
For more information on the HR908-B COM Express Compact Module, please visit: www.dfi.com
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical iagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Intelligent Systems Alliance, DFI works closely with Intel® on development of next-eneration standards-based building blocks, platforms and solutions for the communications and embedded market segments.