DFI today launches PIC-H61, a new Full Size PICMG 1.3 board in its cost-reduced Intel® H61 product line. It is powered by the 3rd/2nd Gen Intel® Core™ processor family paired with the Intel® H61 Express chipset. PIC-H61 is cross compatible with the new 3rd Gen Intel® Core™ processors built on 22-nanometer process technology and with the 2nd Gen Intel® Core™ processors built on 32-nanometer process technology. This cost-effective board is powerful and yet energy-efficient.
The Intel® HD Graphics 3000 engine integrated into these 3rd/2nd Gen Intel® Core™ processors supports 6 Graphics Execution Units (EUs) with dynamic turbo boost to accelerate video processing, and Intel® Clear Video Technology providing advanced imaging capability for Blu Ray and other high definition video processing. Performance is further increased through the introduction of Intel® Advanced Vector Extensions (AVX) to the instruction set, providing acceleration of complex audio, video, and image processing. VGA and DVI-D graphics interface connectors provide dual independent displays: VGA display at rear I/O port supports up to 1920 x 1080 @ 60Hz resolution, and DVI-D (optional) supports up to 2048 x 1536 @ 75Hz resolution through a TMDS connector.
This new scalable desktop platform supports 2 DDR3 DIMM up to 16GB system memory and 2 Intel Gigabit LAN controllers for increased transmission speed. The Intel® H61 Express chipset used on this Full Size PICMG 1.3 board delivers high performance I/O which provides 4 Serial ATA 2.0 ports with speed up to 3Gb/s, 10 USB 2.0 ports, 4 Serial COM ports, 1 parallel connector and 8-bit digital I/O connector for device controls. The PIC-H61offers 1 PCIe x16, 3 PCIe x1 and 8 PCI expansion slots via gold fingers for additional expansion capability.
In addition, this new platform supports Intel® Hyper-Threading and improved Intel® Turbo Boost Technology, which enables each processor core to handle two instruction threads and dynamically increase the clock speed when all cores are not fully utilized. This provides increased performance over the previous generation platform for both multi-core and non-multi-core optimized application programs. The combination of Intel® Hyper-Threading, Intel® Turbo Boost improvements, and the new three-level cache subsystem ensures higher performance at reduced power consumption across a broad-spectrum of embedded processing applications.
The PIC-H61, a Full Size PICMG 1.3 Board with these features described as above, is an ideal choice for industrial computing applications, such as gaming machines, ATM/POS machines, industrial control automation, and digital signage use.
• Full-Size PICMG 1.3 Board (338mm x 122mm)
• Supports 3rd/2nd Gen Intel® Core™ processors
• Intel® H61 Express Chipset
• 2 DDR3 DIMM up to 16GB, dual-channel system memory
• DVI-D and VGA interfaces supporting dual independent displays
• 2 Intel® Gigabit LAN controllers
• 4 Serial COM ports
• 10 USB 2.0 ports
• 4 SATA 2.0 (3Gb/s)
• 8-bit digital I/O connector
• 1 parallel connector
• 1 PCIe x16 slot
3 PCIe x1 slots
All product specifications are subject to change without notice.
Intel® and Core™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an e-mail: email@example.com
For more information on the PIC-H61 Full Size PICMG 1.3 board, please visit: www.dfi.com
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Embedded Alliance (IEA), DFI works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.
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