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ADN171/ADN173｜Intel®｜Industrial Motherboards｜DFI

ADN171/ADN173
Overview
Overview
Specification
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Ordering Information
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Home Industrial Motherboards Mini-ITX ADN171/ADN173
  • Intel® Atom® Alder Lake-N Processors
  • 1 DDR5 4800MHz SO-DIMM update 16GB
  • 4K High Resolution: Supports 4K/ 2K resolution
  • Triple Display: DP++/VGA + HDMI/DP++ + USB-Type C + *M2A-Display (optional)
  • Rich I/O Connectivity: 2 2.5GbE LAN, up to 4 USB 3.2, 1 USB Type C, 2 SATA3, 2 USB2.0
  • Multiple Expansion: 1 M.2 A Key, 1 M.2 B Key, 1 M.2 E Key
  • Typically supports 10-Year CPU Life Cycle Until Q1’ 33 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.

Status : Sample Available QUOTE NOW

Fanless Design
4K2K Display
Multiple Expansion
Triple Independent Display
DDR5
Rich I/O
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RoHS Certification
CE Certification
FCC Certification

ADN171/ADN173 Related Tags

#DDR5#Windows 10#9~36V DC-in#Intel® Atom® Alder Lake-N Processors#IoT#Intel#Fanless Design#4K2K Display#Windows#Linux#HDMI#VGA#DP#Multiple Expansion#12V DC-in#RoHS Certification#CE Certification#FCC Certification#2.5G Ethernet
ADN171/ADN173
ADN171/ADN173
ADN171/ADN173
ADN171/ADN173
ADN171/ADN173
ADN171/ADN173

Related Products:

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System
Processor
Intel® Atom® Alder Lake-N Processors, TDP up to 15W
Intel® Core i3-N305 Processor, 8 Core, 6M Cache, 3.8GHz, 15W
Intel® Processor N200, Quad Core, 6M Cache, 3.7GHz, 6W
Intel® Atom® x7213E Processor, Dual Core, 6M Cache, 3.2GHz, 10W
Intel® Processor N50, Dual Core, 6M Cache, 3.4GHz, 6W
Memory
One 262-pin SODIMM up to 16GB
Single Channel DDR5 4800MHz
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® UHD Graphics
Feature
OpenGL 4.6, Direct X 12.1, OpenCL 3.0
HW Decode: HEVC, VP9, AV1, AVC
HW Encode: HEVC, VP9, AVC
Display
1 x DP++/ VGA (Co-layout)
1 x DP++/ HDMI2.0 (Co-layout)
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
HDMI: resolution up to 3840x2160 @ 24Hz
DP++: resolution up to 3840x2160 @ 60Hz
VGA: resolution up to 2048x1536 @ 60Hz
USB-C: resolution up to 3840x2160 @24Hz
Triple Displays
DP++/VGA + HDMI/DP++ + USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W) + M2A-Display (optional)
Expansion
Interface
1 x PCIe x4 (PCIe signal x2)
1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1 or SATA3 and USB2.0 wi USB3(opt.))
1 x M.2 2230 E Key (PCIE Gen3x1 and USB2.0, support Intel® CNVi)
1 x M.2 3060 A Key support DFI M2A-display module (opt. MOQ required)
1 x Nano SIM socket (connected to M.2 B key)
Audio
Audio Codec
Realtek ALC888S
Ethernet
Controller
2 x Intel® I226V (10/100/1000/2500Mbps)
Rear I/O
Ethernet
2 x 2.5GHz RJ45
USB
4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2 + 1 x USB 2.0 or 3 x USB 3.2 Gen2 + 1 x USB Type C
Display
1 x HDMI /DP++ (opt., MOQ may required)
1 x DP++ /VGA (opt., MOQ may required)
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
Audio
1 x Line-out
Internal I/O
Serial
2 x RS-232/422/485 (RS-232 w/ power) (2.0mm pitch)
4 x RS-232 (2.0mm pitch)
USB
2 x USB 2.0 (2.0mm pitch) or 1 x USB 2.0 (2.00mm pitch) + 1 x Vertical USB 2.0 (type A) (opt., MOQ required)
Audio
1 x S/PDIF
1 x Line-in/Mic-in
SATA
2 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
dTPM (default)
fTPM (option)
Power
Type
Single 12VDC (+/-5%) (ADN171) (DC-In jack by default)
Wide Range 9~36V (ADN173) (4P vertical type by default)
Connector
DC-in Jack
Right Angle Connector (4-pin)
Vertical Type Connector (4-pin)
Consumption
Idle: x7213E 10W: 12V @ 0.62A (7.44W)
Max: x7213E 10W: 12V @ 2.31A (27.72W)
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows IoT Enterprise 10 LTSB
Linux
Linux
Environment
Temperature
Operating: -5 to 65°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
MTBF 478,716 hrs @ 25°C; 297,120 hrs @ 45°C; 197,152 hrs @ 60°C; 148,106 hrs @ 70°C;
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
Mini-ITX Form Factor
170mm (6.7") x 170mm (6.7")
Height
PCB: 1.6mm
Top Side: 20mm
Bottom Side: 3mm
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
1 ADN171/ADN173 motherboard
1 COM port cable (Length: 250mm, 1 x COM ports)
1 Serial ATA data & power cable w/lock (Length: 300mm)
1 Heat sink
Country of Origin
Country of Origin
Taiwan
Product Collaterals
Technical Documents
Ordering Information
  • Model Name Part Number Description
  • Model Name :
    ADN171-CB-x7213E     Part Number :
     770-ADN1711-000G     Description :
    Intel® Atom® x7213E, 1 DDR5, Rear I/O(1 DP++, 1 VGA, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
  • Model Name :
    ADN171-CB-N200     Part Number :
     770-ADN1711-100G     Description :
    Intel® Processor N200, 1 DDR5, Rear I/O(1 DP++, 1 HDMI, 2 LAN, 4 USB 3.2 Gen2), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
  • Model Name :
    ADN171-CB-N50     Part Number :
     770-ADN1711-200G     Description :
    Intel® Processor N50, 1 DDR5, Rear I/O(2 DP++, 2 LAN, 3 USB 3.2 Gen2, 1 USB 2.0), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
  • Model Name :
    ADN173-CB-x7213E     Part Number :
     770-ADN1731-000G     Description :
    Intel® Atom® x7213E, 1 DDR5, Rear I/O(1 DP++, 1 HDMI, 2 LAN, 3 USB 3.2 Gen2, 1 USB 2.0), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 9~36V DC, Fanless, -5 to 65°C
  • Model Name :
    ADN173-CB-N50     Part Number :
     770-ADN1731-100G     Description :
    Intel® Processor N50, 1 DDR5, Rear I/O(2 DP++, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 9~36V DC, Fanless, -5 to 65°C

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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