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EXT-DP

Industrial Motherboards Peripherals EXT-DP
  • CHIP: SN75DP130
  • PORT: 1 DP
  • INTERFACE: DP
  • DIMENSIONS: 50mm x 40mm (1.97" x 1.57")
  • Module Boards

Status : MOQ Required

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EXT-DP	Module Boards
EXT-DP	Module Boards
Specifications
Features
CHIP: Re-Driver SN75DP130
Features: Supports DP v1.1a and DP v1.2 signaling including HBR Data
rates to 2.7Gbps
REAR PANEL I/O PORTS: 1 DP port, I/O CONNECTORS, 1 DP connector, 1 LCD/Inverter power connector
APPLIED MODEL: HU171/173, HU101/103, HM100/101/103-QM87/HM86
TEMPERATURE:
Operating: 0°C to 60°C
Storage: -20°C to 85°C
HUMIDITY: 5% to 90%
DIMENSIONS: 50mm x 40mm (1.97" x 1.57")
Country of Origin
Country of Origin
Taiwan

Working with DFI

DFI’s Customization Services (DCS) comes with full support and industry expertise from a dedicated team to provide you exclusive services in design, production, warranty, repairs, and life cycle management. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

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