DFI today launches the COM Express basic type 2 form factor HR900-B mobile platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded module uses an Intel QM67 Express chipset supporting the quad core 2nd Generation Intel Core i7-2710QE processor and dual core 2nd Generation Intel Core i5-2510E processor on 32nm process technology. The graphics and processor cores are integrated on a single monolithic die and provide Intel HD graphics support for DVI-I, LVDS and VGA display interfaces. The 32nm Intel Core microarchitecture provides higher performance at lower power than previous generation processors, and includes the first mobile quad-core processor with an integrated graphics core. Performance is further increased through the introduction of Intel Advanced Vector Extensions (Intel AVX) to the instruction set, providing acceleration of complex audio, video, and image processing.
In addition, this new platform supports Intel Hyper-Threading and improved Intel Turbo Boost Technology 2.0, which enables each processor core to handle two instruction threads and dynamically increase the clock speed when all cores are not fully utilized. This provides increased performance over the previous generation platform for both multi-core and non-multi-core optimized application programs. The combination of Intel Hyper-Threading, Intel Turbo Boost Technology improvements, and the new three-level cache subsystem insures higher performance at reduced power consumption across a broad-spectrum of embedded processing applications.
Support is provided for up to 8GB of DDR3 1066/1333 MHz dual-channel system memory, two Gigabit LAN controllers, and up to four display ports using carrier based DVI, HDMI, LVDS, and VGA display interfaces. The integrated Intel HD graphics engine supports six graphics execution units with dynamic turbo boost to accelerate video processing, and Intel Clear Video Technology providing advanced imaging capability for Blu Ray and other high definition video processing.
The HR900-B also supports Intel High Definition Audio, two Serial ATA ports with speed up to 3Gb/s, two Serial ATA ports with speed up to 6Gb/s, eight USB 2.0 host controller ports, one PCI Express x16 expansion interfaces (Gen 2), 5 PCI Express x1 expansion interfaces, and 4 PCI expansion interfaces.
This embedded COM Express basic type 2 form factor module is ideal for applications requiring a stable revision-controlled platform such as industrial control automation, digital signage, kiosk, medical equipment, and gaming embedded applications.
• PICMG COM Express R1.0 basic form factor, type 2 (95mm x 125mm)
• Supports 2nd Generation Intel Core i7-2710QE and i5-2510E processors
• Intel BD82QM67 Platform Controller Hub
• Up to 8GB of DDR3 1066/1333 MHz dual-channel memory
• SDVO and VGA display interfaces
• 18/24bit LVDS display interface
• 2 Gigabit Ethernet LAN ports
• 2 SATA ports (3Gb/s)
• 2 SATA ports (6Gb/s)
• 8 USB ports
• 1 PCI Express x16 expansion interface (Gen 2)
• 5 PCI Express x1 expansion interfaces
• LPC Interface
• 8 Digital I/O Interfaces
• Operating Temperature Range: 0°C ~ 60°C
All product specifications are subject to change without notice.
Intel and Atom are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an email: firstname.lastname@example.org
For more information on the HR900-B, please visit: www.dfi.com
Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 29 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel Embedded Alliance (IEA), DFI works closely with Intel on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.
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