DFI, a leading provider offering a wide range of products for diversified industrial applications, today launches a new Type 10 COM Express Mini module, the CD9A3 Series, in its Intel® NM10 based-chipset product line supporting the next-generation Intel® Atom™ processors. The CD9A3 Series is DFI's first COM Express Mini form factor that pairs an Intel® NM10 Express chipset with a range of Intel® Atom™ processors, from the power-efficient Intel® Atom™ N2600 processor to the enhanced Intel® Atom™ D2550 processor as the table listed below.
These new dual-core processors are built on Intel's 32-nanometer process technology providing low power consumption and yet higher clock frequencies and faster memory access than their predecessors that are built on 45-nanometer technology. The Intel® NM10 Express chipset paired with these new COM Express Mini platforms offers excellent processing performances in media, graphics and I/O flexibilities, and stunning and seamless visual experiences to fill up the carrier board requirements.
Targeted at multimedia and medical applications, the next-generation Intel® GMA Graphics 3650 (with the Intel® Atom™ D2550/N2800 processors) and 3600 (with the Intel® Atom™ N2600 processor) engine integrated into these Intel® Atom™ processor-based platforms support high-end enhanced media and graphics capabilities and improve performance. Performance is further increased through the instruction of DirectX Video Acceleration (DXVA) providing acceleration of complex audio, video, and image processing. The Intel® GMA Graphics accelerator integrated into the CD9A3 Series offers LVDS and DDI display outputs to support 2 independent display capabilities. The CD9A3-25B20 with the Intel® Atom™ D2550 processor displays LVDS output up to 18/24bit, 1440x900 resolution, and the CD9A3-28B20 and CD9A3-26B20 with the Intel® Atom™ N2800/N2600 processors display LVDS output up to 18bit, 1366x768 resolution. HDMI/DVI displays graphics resolution up to 1920x1200, and DisplayPort displays up to 1600x1200 resolutions. The graphics devices on the CD9A3 Series can also support Hardware H.264/AVC, MPEG-2 video decoder, VC-1, DirectX 9, and 1080p decoder.
In system memory, the CD9A3 Series COM Express Mini form factor designed with 2GB onboard DDR3 onboard delivers maximum performance with low voltage memory for faster communication between components. The memory controller and graphics core are placed on the processor die to provide a tightly-coupled, two-chip system architecture resulting in higher performance and lower power consumption. The onboard memory storage, an optional SSD device, offers the persistent function of data storage up to 32GB and operates the maximum performance of write at 30MB/sec and read at 70MB/sec.
For applications requiring a low power solution with passive cooling, the CDA3-26B20 with heatsink (fanless solution) uses the Intel® Atom™ N2600 processor to offer the modest performance with 1.6GHz clock speed. For maximum performance, the CD9A3-25B20 with heatsink plus cooling fan and the CD9A3-28B20 with heatsink (fanless solution) use the Intel®Atom™ D2550/N2800 processors respectively to operate at 1.86GHz clock speed. In the thermal test, the CD9A3 Series uses thermal probe to measure each components in order to determine the actual temperature of each component. The CD9A3 Series providing MTBF and MTTF based on the thermal test also results in the thermal simulation of customized heatsink.
In addition, the CD9A3 Series is packed with high performance and flexible I/O with the Intel® NM10 Express chipset. The series provides High Definition Audio interface, 8-bit Digital I/O connector for device controls, and the Intel® I210AT Gigabit LAN controller integrated up to 1GB transceiver fully compliant with IEEE 802.3, IEE802.3u, and IEEE802.3ab supports wire management to increase transmission speed for network-intensive applications. The Advanced Host Controller Interface (AHCI) controller integrated into the CD9A3 Series COM Express Mini module supports 2 Serial ATA 2.0 interfaces with data transfer rate up to 3Gb/s for applications that need fast storage speed. With 8 USB 2.0 ports, these new PICMG COM Express Mini form factors allow your system to process more data load and provide faster loading of frequently used applications. The expansion design of the CD9A3 Series platforms offers additional capabilities for customers' multiple demands via 3 PCIe x1 slots.
All these features described above combined with the CD9A3 Series COM Express Mini module make it an ideal product for unlimited usage on various industrial applications which require a stable revision-controlled platform, such as industrial control automation, digital signage, medical equipment, and KIOSK embedded applications.
CD9A3 Series Features:
• PICMG COM Express R2.1 Mini form factor, Type 10 (84mm x 55mm)
• Supports Intel® Atom™ D2550/N2800/N2600 processors
• Intel® NM10 Express chipset
• 2GB onboard DDR3 system memory
• 1 LVDS and 1 DDI interfaces support 2 independent displays
• 2 SATA 2.0 with data transfer rate up to 3Gb/s
• 8 USB 2.0 ports
• 1 Intel® Gigabit LAN controller
• 3 PCIe x1 slots
• 8-bit Digital I/O connector
• SATA to SSD onboard (optional)
• Operating Temperature Range: 0°C to 60°C
All product specifications are subject to change without notice.
Intel® and Atom™ are registered trademarks of the Intel Corporation in the U.S. and other countries.
For more information, please call DFI sales or send us an e-mail: email@example.com
For more information on the CD9A3 Series COM Express Mini Module, please visit: www.dfi.com
Established in 1981, DFI® is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI®focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel® Embedded Alliance (IEA), DFI works closely with Intel® on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.